Thermal oxidationIn microfabrication, thermal oxidation is a way to produce a thin layer of oxide (usually silicon dioxide) on the surface of a wafer. The technique forces an oxidizing agent to diffuse into the wafer at high temperature and react with it. The rate of oxide growth is often predicted by the Deal–Grove model. Thermal oxidation may be applied to different materials, but most commonly involves the oxidation of silicon substrates to produce silicon dioxide.
Synchronous dynamic random-access memorySynchronous dynamic random-access memory (synchronous dynamic RAM or SDRAM) is any DRAM where the operation of its external pin interface is coordinated by an externally supplied clock signal. DRAM integrated circuits (ICs) produced from the early 1970s to early 1990s used an asynchronous interface, in which input control signals have a direct effect on internal functions only delayed by the trip across its semiconductor pathways. SDRAM has a synchronous interface, whereby changes on control inputs are recognised after a rising edge of its clock input.
Aluminum electrolytic capacitorAluminum electrolytic capacitors are polarized electrolytic capacitors whose anode electrode (+) is made of a pure aluminum foil with an etched surface. The aluminum forms a very thin insulating layer of aluminum oxide by anodization that acts as the dielectric of the capacitor. A non-solid electrolyte covers the rough surface of the oxide layer, serving in principle as the second electrode (cathode) (-) of the capacitor. A second aluminum foil called “cathode foil” contacts the electrolyte and serves as the electrical connection to the negative terminal of the capacitor.
Computer-aided engineeringComputer-aided engineering can be defined as the general usage of technology to aid in tasks related to engineering analysis. Any use of technology to solve or assist engineering issues falls under this umbrella. Following alongside the consistent improvement in computer graphics and speed, computer aid assists engineers with once complicated and time consuming tasks with the input of information and a press of a button. It includes finite element analysis (FEA), computational fluid dynamics (CFD), multibody dynamics (MBD), durability and optimization.
Polymer capacitorA polymer capacitor, or more accurately a polymer electrolytic capacitor, is an electrolytic capacitor (e-cap) with a solid conductive polymer electrolyte. There are four different types: Polymer tantalum electrolytic capacitor (Polymer Ta-e-cap) Polymer aluminium electrolytic capacitor (Polymer Al-e-cap) Hybrid polymer capacitor (Hybrid polymer Al-e-cap) Polymer niobium electrolytic capacitors Polymer Ta-e-caps are available in rectangular surface-mounted device (SMD) chip style.
Extremely low frequencyExtremely low frequency (ELF) is the ITU designation for electromagnetic radiation (radio waves) with frequencies from 3 to 30 Hz, and corresponding wavelengths of 100,000 to 10,000 kilometers, respectively. In atmospheric science, an alternative definition is usually given, from 3 Hz to 3 kHz. In the related magnetosphere science, the lower frequency electromagnetic oscillations (pulsations occurring below ~3 Hz) are considered to lie in the ULF range, which is thus also defined differently from the ITU radio bands.
Electronic componentAn electronic component is any basic discrete electronic device or physical entity part of an electronic system used to affect electrons or their associated fields. Electronic components are mostly industrial products, available in a singular form and are not to be confused with electrical elements, which are conceptual abstractions representing idealized electronic components and elements. Electronic components have a number of electrical terminals or leads.
Tantalum capacitorA tantalum electrolytic capacitor is an electrolytic capacitor, a passive component of electronic circuits. It consists of a pellet of porous tantalum metal as an anode, covered by an insulating oxide layer that forms the dielectric, surrounded by liquid or solid electrolyte as a cathode. Because of its very thin and relatively high permittivity dielectric layer, the tantalum capacitor distinguishes itself from other conventional and electrolytic capacitors in having high capacitance per volume (high volumetric efficiency) and lower weight.
Comparison of computer-aided design softwareThe table below provides an overview of notable computer-aided design (CAD) software. It does not judge power, ease of use, or other user-experience aspects. The table does not include software that is still in development (beta software). For all-purpose 3D programs, see Comparison of 3D computer graphics software. CAD refers to a specific type of drawing and modelling software application that is used for creating designs and technical drawings. These can be 3D drawings or 2D drawings (like floor plans).
Carrier generation and recombinationIn the solid-state physics of semiconductors, carrier generation and carrier recombination are processes by which mobile charge carriers (electrons and electron holes) are created and eliminated. Carrier generation and recombination processes are fundamental to the operation of many optoelectronic semiconductor devices, such as photodiodes, light-emitting diodes and laser diodes. They are also critical to a full analysis of p-n junction devices such as bipolar junction transistors and p-n junction diodes.
