Study of bending reliability and electrical properties of platinum lines on flexible polyimide substrates

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A Front-End CMOS Interface Circuit With High Voltage Charge Pump and Oscillator for Capacitive Micromachined Ultrasonic Transducers

Sandro Carrara, Gian Luca Barbruni, Zhengwen Jiang, Yihe Zhao

Label-free biosensors, combined with miniaturized micro-electromechanical sensory platforms, offer an attractive solution for real-time and facile monitoring of biomolecules due to their high sensitivity and selectivity without the need for specifically la ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Integrated silicon photonic MEMS

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi

Silicon photonics has emerged as a mature technology that is expected to play a key role in critical emerging applications, including very high data rate optical communications, distance sensing for autonomous vehicles, photonic-accelerated computing, and ...

SPRINGERNATURE2023

Development of stencil lithography for stretchable interconnects

Yi-Chiang Sun

The growing needs for human healthcare have driven the development of wearable devices for monitoring the health status of an individual. Polymers represent a promising platform for such devices due to their ability to form an intimate contact between soft ...

EPFL2022

Intergrade Joints for Nb3Sn cables of high magnetic field magnets

Vincenzo D'Auria

The objective of this thesis is the development of high-field and high-current joints between Nb3Sn cables for superconducting coils. The main fields of application are high energy physics (HEP) and thermonuclear fusion. In this thesis, the focus is on Win ...

EPFL2022

Application of Copper Thermal Spraying for Electrical Joints between Superconducting Nb3Sn Cables

Pierluigi Bruzzone, Vincenzo D'Auria

This manuscript reports on the application of copper thermal spraying in the manufacturing process of an electrical connection between Nb3Sn cables for superconducting magnets of fusion reactors. The joint is realized through diffusion bonding of the spray ...

MDPI2022

Diffusion-Bonding Between Strands and Modeling of Splices of Nb3Sn Rutherford Cables

Pierluigi Bruzzone, Kamil Sedlák, Nikolay Bykovskiy

Particle accelerators foresee the use of Nb3Sn in the next generation of dipole magnets. A common design strategy is to grade the coil, i.e., to optimize the quantity of superconductor in the turns with respect to the magnetic field intensity. As a consequ ...

IEEE Institute of Electrical and Electronics Engineers2022

3D printing of elastomeric mechanical sensors designed for human motion monitoring

Ryan Mitchell van Dommelen

In this thesis several advances are made to the emerging field of 3D printed mechanical sensors. Techniques and processes were developed to enable the integration of highly conductive, and capacitive and piezoresistive sensing features embedded within 3D p ...

EPFL2022

Surface Susceptibilities as Characteristic Models of Reflective Metasurfaces

Karim Achouri, Shourya Dutta Gupta, Ville Tuovi Tiukuvaara

While metasurfaces (MSs) are constructed from deeply subwavelength unit cells, they are generally electrically large and full-wave simulations of the complete structure are computationally expensive. Thus, to reduce this high computational cost, nonuniform ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2022

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A Front-End CMOS Interface Circuit With High Voltage Charge Pump and Oscillator for Capacitive Micromachined Ultrasonic Transducers

Sandro Carrara, Gian Luca Barbruni, Zhengwen Jiang, Yihe Zhao

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023