Gorlov helical turbineThe Gorlov helical turbine (GHT) is a water turbine evolved from the Darrieus turbine design by altering it to have helical blades/foils. Water turbines take kinetic energy and translates it into electricity. It was patented in a series of patents from September 19, 1995 to July 3, 2001 and won 2001 ASME Thomas A. Edison. GHT was invented by Alexander M. Gorlov, professor of Northeastern University.
Steam turbineA steam turbine is a machine that extracts thermal energy from pressurized steam and uses it to do mechanical work on a rotating output shaft. Its modern manifestation was invented by Charles Parsons in 1884. Fabrication of a modern steam turbine involves advanced metalwork to form high-grade steel alloys into precision parts using technologies that first became available in the 20th century; continued advances in durability and efficiency of steam turbines remains central to the energy economics of the 21st century.
Air source heat pumpAn air source heat pump (ASHP) is a type of heat pump that can absorb heat from outside a structure and release it inside using the same vapor-compression refrigeration process and much the same equipment as air conditioners but used in the opposite direction. Unlike an air conditioning unit, most ASHPs are reversible and are able to either warm or cool buildings and in some cases also provide domestic hot water. In a typical setting, an ASHP can gain 4 kWh thermal energy from 1 kWh electric energy.
Passive coolingPassive cooling is a building design approach that focuses on heat gain control and heat dissipation in a building in order to improve the indoor thermal comfort with low or no energy consumption. This approach works either by preventing heat from entering the interior (heat gain prevention) or by removing heat from the building (natural cooling). Natural cooling utilizes on-site energy, available from the natural environment, combined with the architectural design of building components (e.g.
Air conditioningAir conditioning, often abbreviated as A/C (US), AC (US), or air con (UK), is the process of removing heat from an enclosed space to achieve a more comfortable interior environment (sometimes referred to as "comfort cooling") and in some cases also strictly controlling the humidity of internal air. Air conditioning can be achieved using a mechanical air conditioner or alternatively a variety of other methods, including passive cooling or ventilative cooling.
AirfoilAn airfoil (American English) or aerofoil (British English) is a streamlined body that is capable of generating significantly more lift than drag. Wings, sails and propeller blades are examples of airfoils. Foils of similar function designed with water as the working fluid are called hydrofoils. When oriented at a suitable angle, a solid body moving through a fluid deflects the oncoming fluid (for fixed-wing aircraft, a downward force), resulting in a force on the airfoil in the direction opposite to the deflection.
Copper in heat exchangersHeat exchangers are devices that transfer heat to achieve desired heating or cooling. An important design aspect of heat exchanger technology is the selection of appropriate materials to conduct and transfer heat fast and efficiently. Copper has many desirable properties for thermally efficient and durable heat exchangers. First and foremost, copper is an excellent conductor of heat. This means that copper's high thermal conductivity allows heat to pass through it quickly.
Wind turbineA wind turbine is a device that converts the kinetic energy of wind into electrical energy. , hundreds of thousands of large turbines, in installations known as wind farms, were generating over 650 gigawatts of power, with 60 GW added each year. Wind turbines are an increasingly important source of intermittent renewable energy, and are used in many countries to lower energy costs and reduce reliance on fossil fuels.
Thermal management (electronics)All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.
Thermal design powerThe thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called scenario design power (SDP) for some Ivy Bridge Y-series processors.
