Concept

Nombre de Biot

Publications associées (35)

In-plane conduction of polymer composite plates reinforced with architectured networks of Copper fibres

Model composite plates composed of highly conductive slender copper fibres impregnated with a poorly conductive and transparent PMMA matrix were processed with different fibrous architectures, i.e. with various controlled fibre contents and orientations. T ...

Springer Verlag2012

Numerical Modeling of the Conjugate Heat Transfer Problem for Annular Laminar Film Condensation in Microchannels

John Richard Thome, Stefano Nebuloni

This paper presents numerical simulations of annular laminar film condensation heat transfer in microchannels of different internal shapes. The model, which is based on a finite volume formulation of the Navier-Stokes and energy equations for the liquid ph ...

2012

MATHICSE Technical Report : Convergence of quasi-optimal stochastic Galerkin methods for a class of PDES with random coefficients

Fabio Nobile, Lorenzo Tamellini

In this work we consider quasi-optimal versions of the Stochastic Galerkin Method for solving linear elliptic PDEs with stochastic coeffcients. In particular, we consider the case of a finite number N of random inputs and an analytic dependence of the solu ...

MATHICSE2012

Analytical Heat Transfer Model for Thermal Through-Silicon Vias

Giovanni De Micheli, Vasileios Pavlidis, Hu Xu

Thermal issues are one of the primary challenges in 3-D integrated circuits. Thermal through-silicon vias (TTSVs) are considered an effective means to reduce the temperature of 3-D ICs. The effect of the physical and technological parameters of TTSVs on th ...

2011

Cooling High Heat Flux Micro-Electronic Systems using Refrigerants in High Aspect Ratio Multi-Microchannel Evaporators

Etienne Costa-Patry

Improving the energy efficiency of cooling systems can contribute to reduce the emission of greenhouse gases. Currently, most microelectronic applications are air-cooled. Switching to two-phase cooling systems would decrease power consumption and allow for ...

EPFL2011

Parametric study for the cooling of high temperature superconductor (HTS) current leads

Rainer Wesche

The analysis of cooling of a binary HTS 20 kA current lead (CL) operating between 4.5 and 300 K has been carried out. Assuming that the HTS module is conduction-cooled, two cooling options for the copper heat exchanger (HEX) part of the CL have been consid ...

Elsevier Sci Ltd2011

Study of Spatio-Temporal Immunofluorescence on Bead Patterns in a Microfluidic Channel

Martinus Gijs, Venkataragavalu Sivagnanam, Hui Yang

We performed a direct immunoassay inside a microfluidic channel on patterned streptavidin-coated beads, which captured fluorescently-labeled biotin target molecules from a continuous flow. We arranged the beads in a dot array at the bottom of the channel a ...

American Institute of Physics2010

On the truly meshless solution of heat conduction problems in heterogeneous media

Aurèle Parriaux, Jiannong Fang, Jian Zhao, Gaofeng Zhao

A truly meshless method based on the weighted least-squares (WLS) approximation and the method of point collocation is proposed to solve heat conduction problems in heterogeneous media. It is shown that, in the case of strong heterogeneity, accurate and sm ...

2009

Reduced Basis Methods and A Posteriori Error Estimators for Heat Transfer Problems

Simone Deparis, Gianluigi Rozza

This paper focuses on the parametric study of steady and unsteady forced and natural convection problems by the certified reduced basis method. These problems are characterized by an input-output relationship in which given an input parameter vector — mate ...

ASME2009

Transient Heat Transfer Model and Stability Analysis of helium-cooled Superconducting Cables

Luca Bottura, Pier Paolo Granieri, Panagiota Xydi

The stability is a key issue to design superconducting magnets and to ensure their proper exploitation. This is the case of the imminent operation of the Large Hadron Collider (LHC) accelerator, which requires a good knowledge of the stability margin of it ...

2008

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