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Three-dimensional (3-D) integration is a promising solution to further enhance the density and performance of modern integrated circuits (ICs). In 3-D ICs, multiple dies (tiers or planes) are vertically stacked. These dies can be designed and fabricated se ...
Configurable high-performance bias current reference circuits are useful in complex mixed-signal chips. This paper presents the design of a configurable current reference array with ultra wide dynamic range (DR). A coarse-fine architecture using octal coar ...
A new prediction algorithm for multipactor breakdown determination in multicarrier signals is presented. This new algorithm assumes a quasi-stationary (QS) model based on the nonstationary theory for single-carrier signals. It determines the worst case, i. ...
Institute of Electrical and Electronics Engineers2012
This paper presents a flow that is suitable to estimate energy dissipation of digital standard-cell based designs which are determined to operate in the subthreshold regime. The flow is applicable on gate-level netlists, where back-annotated toggle informa ...
In modern VLSI circuits, a large number of clock buffers are inserted in clock distribution networks, which are significantly affected by process and power supply noise variations. The combined effect of process variations and power supply noise on clock s ...
Dielectric elastomer artificialmuscles have great potential for the creation of novel pumps, motors, and circuitry. Control of these devices requires an oscillator, either as a driver or clock circuit, which is typically provided as part of bulky, rigid, a ...
Objective: Motor changes in major depression (MD) may represent potential markers of treatment response. Physiological rhythms (heart rate/gait cycle/hand movements) have been recently shown to be neither random nor regular but to display a fractal tempora ...
Power-frequency scaling in subthreshold source coupled logic (STSCL) systems has been studied and analyzed. It is shown that the operating frequency of such systems can be adjusted over about three decades with linearly proportional power dissipation. The ...
3-D integration is an important technology that addresses fundamental limitations in on-chip interconnects. Several design issues related to 3-D circuits, such as multiplane synchronization, however, need to be addressed. A comparison of three 3-D clock di ...
In three-dimensional (3D) integrated circuits, the effect of process variations on clock skew differs from 2D circuits. The combined effect of inter-die and intra-die process variations on the design of 3D clock distribution networks is considered in this ...