Concept

Atmosphère protectrice

Publications associées (20)

Electrospun zein incorporating phycocyanin and Spirulina extract: Fabrication, characterization, and potential application

Electrospinning was used to develop zein fibers containing phycocyanin and aqueous-ethanolic extract of Spirulina (AEES) for elucidating the potent packaging properties of phycocyanin and AEES on walnut samples. Morphological results revealed that using th ...

Amsterdam2023

High-order accurate well-balanced energy stable adaptive moving mesh finite difference schemes for the shallow water equations with non-flat bottom topography

Junming Duan, Zhenying Zhang

This paper proposes high-order accurate well-balanced (WB) energy stable (ES) adaptive moving mesh finite difference schemes for the shallow water equations (SWEs) with non flat bottom topography. To enable the construction of the ES schemes on moving mesh ...

ACADEMIC PRESS INC ELSEVIER SCIENCE2023

Lignin, from biomass waste to sustainable materials for food packaging, antiviral coatings and agriculture

Alice Boarino

Our planet has been challenged for years by our reckless use of fossil fuels, which has led to the ongoing climate change and energy crisis. The transition to the use of renewable alternative sources has now became urgent and inevitable. The valorization o ...

EPFL2023

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi, Göran Stemme

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Effect of Backsheet Properties on PV Encapsulant Degradation during Combined Accelerated Aging Tests

Andreas Schueler, Djamel Eddine Mansour

Long-term photovoltaic (PV) module reliability is highly determined by the durability of the polymeric components (backsheet and encapsulation materials). This paper presents the result of experiments on encapsulant degradation influenced by the backsheet ...

2021

Advances and Gaps in the Research of Environmental Impacts of Food Packaging Applications using LCA

Developing food packaging applications based on materials from renewable resources, such as biobased plastics, is considered as potential solution to reduce the environmental impacts of packaging. While each specific industry applies the Life Cycle Assessm ...

Paul Scherrer Institute, World Resources Forum2019

Organic-Inorganic Hybrid Planarization and Water Vapor Barrier Coatings on Cellulose Nanofibrils Substrates

Yves Leterrier, Feyza Karasu Kiliç

Cellulose nanofibrils (CNF) can be produced in the form of thin, transparent and flexible films. However, the permeability of such materials to oxygen and water vapor is very sensitive to moisture, which limits their potential for a variety of packaging an ...

2018

High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS

Nico de Rooij, Danick Briand, Terunobu Akiyama, Rokhaya Gueye

A System-in-Package (SiP) concept for the 3D-integration of a Single Wall Carbon Nanotube (SWCNT) resonator with its CMOS driving electronics is presented. The key element of this advanced SiP is the monolithic 3D-integration of the MEMS with the CMOS elec ...

SPIE - International Society of Optical Engineering2013

Integrated packaging solutions and hotplates for a miniature atomic clock and other microsystems

Fabrizio Vecchio

This thesis aimed at developing innovative packaging solutions for a miniature atomic clock and other microsystems in the cm-scale, i.e. somewhat larger than what is practical for full "chip-scale" device-package integration using clean-room technologies f ...

EPFL2013

Hermetic package for optical MEMS

Peter Ryser, Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally low t ...

2009

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