Concept

Atmosphère protectrice

Publications associées (20)

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

The quantity of MEMS manufacturers has considerably been increasing these last years. This doesn't mean that the introduction of such products on the market has become easier. A packaging operation is needed to obtain a usable product out of a microsystem. ...

EPFL2009

Flip chip bonding technologies for hybrid integration

Hybrid integration and especially the packaging of microelectromechanical systems (i.e. MEMS) cannot rely on standardised packaging solutions due to the diversity of microsystems. As an example, the packaging requirements of a pressure sensor are different ...

Institut de Microtechnique, Université de Neuchâtel2009

Hermetic package for optical MEMS

Peter Ryser, Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally low t ...

2008

LTCC active oxygen getter module for hermetic packaging applications

Peter Ryser, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur, Timothée Haller

LTCC and thick-film technologies constitute excellent platforms for hermetic and controlled-atmosphere packaging, for applications in MEMS, space, micro/nanofabrication and biological fields. This work presents an active oxygen getter module, based on an i ...

IMAPS2008

0-level Vacuum Packaging RT Process for MEMS Resonators

Mihai Adrian Ionescu, Cyrille Hibert, Daniel Grogg, Nicolas Abelé

A new Room Temperature (RT) 0-level vacuum package is demonstrated in this work, using amorphous silicon (aSi) as sacrificial layer and SiO2 as structural layer. The process is compatible with most of MEMS resonators and Resonant Suspended-Gate MOSFET [1] ...

2008

La0.5Sr0.5Fe1-yMyO3-[delta] (M = Ti, Ta) perovskite oxides for oxygen separation membranes

Defne Bayraktar

Mixed ionic electronic conducting perovskite materials have been receiving considerable attention for the application of oxygen separation membranes. These membranes have potential to be integrated in industrial processes that require pure oxygen and to pr ...

EPFL2008

Laser soldering of LTCC hermetic packages with minimal thermal impact

Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

A novel laser soldering method for hermetic packaging of temperature sensitive devices such as organic electronics, micro- and nanostructures is presented in this work. The package combines a thermally optimized LTCC (Low Temperature Co-fired Ceramic) base ...

2007

Gas-barrier material

Yves Leterrier

The invention relates to novel gas-barrier materials for food packaging, based on transparent nanosized hybrid organic/inorganic films on polymer substrates. By contrast with current brittle oxides, these new materials combine extremely high cohesive stren ...

2006

Simulation of SOFC stack and repeat elements including interconnect degradation and anode reoxidation risk

Daniel Favrat, Jan Van Herle, Diego Larrain

Reliability of SOFC stacks is a complex and key issue. This paper presents a simulation study including some degradation processes, namely, interconnect degradation and the anode reoxidation potential. Quantification for these phenomena has been included i ...

2006

Effects of electrical leakage currents on MEMS reliability and performance

Herbert Shea, Shan Jin

Electrostatically driven MEMS devices commonly operate with electric fields as high at 108 V/m applied across the dielectric between electrodes. Even with the best mechanical design, the electrical design of these devices has a large impact both on perform ...

Institute of Electrical and Electronics Engineers2004

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