MSE-464: Assembly techniquesIntroduction to the assembly of materials by homogeneous or heterogeneous joints (welding, bonding, mechanical assembly). Mechanical and environmental resistance of joints.
CH-110: Advanced general chemistry ILe cours comporte deux parties. Les bases de la thermodynamique des équilibres et de la cinétique des réactions sont introduites dans l'une d'elles. Les premières notions de chimie quantique sur les é
MSE-486: Organic electronic materialsThis course will introduce students to the field of organic electronic materials. The goal of this course is to discuss the origin of electronic properties in organic materials, charge transport mecha
CH-160(b): General chemistryCet enseignement vise l'acquisition des notions essentielles relatives à la structure de la matière, aux équilibres et à la réactivité chimiques. Le cours et les exercices fournissent la méthodologie
MSE-422: Advanced metallurgyThis course covers the metallurgy, processing and properties of modern high-performance metals and alloys (e.g. advanced steels, Ni-base, Ti-base, High Entropy Alloys etc.). In addition, the principle
MSE-431: Physical chemistry of polymeric materialsThe student has a basic understanding of the physical and physicochemical principles which result from the chainlike structure of synthetic macromolecules. The student can predict major characteristic
CIVIL-235: Design of steel structuresCe cours permet de maitriser les aspects fondamentaux et pratiques du dimensionnement des structures en acier. Il traite des poutres, des poteaux, des assemblages, des cadres, des systèmes porteurs et
CH-223: Organometallic chemistryBasic organometallic chemistry will be covered in this course.
- Structure and bonding in organometallic compounds.
- reactivity of organometallic compounds, stoichiometric reactions, catalyzed rea
PHYS-407: Frontiers in nanosciencesThe students understand the relevant experimental and theoretical concepts of nanoscale science. The course covers basic concepts like quantum size effects and their characterization techniques, and h
