Concept

Boîtier de circuit intégré

Publications associées (87)

LTCC active oxygen getter module for hermetic packaging applications

Peter Ryser, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur, Timothée Haller

LTCC and thick-film technologies constitute excellent platforms for hermetic and controlled-atmosphere packaging, for applications in MEMS, space, micro/nanofabrication and biological fields. This work presents an active oxygen getter module, based on an i ...

IMAPS2008

Hermetic package for optical MEMS

Peter Ryser, Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally low t ...

2008

Reliability analysis of lead-free solders for an aerospace application

A deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application, SwissCube’s motherboard (MB). Since 2006, using Pb in consumer electronics has been banned. Aerospac ...

2008

Reliability analysis of lead-free solders for an aerospace application

2008

0-level Vacuum Packaging RT Process for MEMS Resonators

Mihai Adrian Ionescu, Cyrille Hibert, Daniel Grogg, Nicolas Abelé

A new Room Temperature (RT) 0-level vacuum package is demonstrated in this work, using amorphous silicon (aSi) as sacrificial layer and SiO2 as structural layer. The process is compatible with most of MEMS resonators and Resonant Suspended-Gate MOSFET [1] ...

2008

Improving the Power-Delay Product in SCL Circuits Using Source Follower Output Stage

Seyed Armin Tajalli, Yusuf Leblebici

This article explores the effect of using source follower buffers (SFB) at the output of source coupled logic (SCL) circuits. This technique can help to improve the power-delay product (PDP) in an SCL gate by a factor close to two. The proposed approach ha ...

IEEE2008

Microsystem technologies for implantable applications

Nico de Rooij

Microsystem technologies (MST) have become the basis of a large industry. The advantages of MST compared to other technologies provide opportunities for application in implantable biomedical devices. This paper presents a general and broad literature revie ...

2007

High quality factor copper inductors integrated in deep dry-etched quartz substrates

Mihai Adrian Ionescu, Didier Bouvet, Cyrille Hibert

This paper reports on an inductor fabrication method capable to deliver high quality factor (Q) and high self-resonance frequency (SRF) devices using quartz insulating substrates and thick high-conductivity copper lines. Inductors are key devices in RF cir ...

Springer-Verlag2007

Laser soldering of LTCC hermetic packages with minimal thermal impact

Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

A novel laser soldering method for hermetic packaging of temperature sensitive devices such as organic electronics, micro- and nanostructures is presented in this work. The package combines a thermally optimized LTCC (Low Temperature Co-fired Ceramic) base ...

2007

Semiconductor memory device and method of operating same

Serguei Okhonin

There are many inventions described and illustrated herein. In a first aspect, the present invention is directed to a memory device and technique of reading data from and writing data into memory cells of the memory device. In this regard, in one embodimen ...

2007

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