Publications associées à Ventilateur d'ordinateur

Present design of the Steering Mirror Assembly (SMA) for ITER ECHUL

Timothy Goodman, René Chavan, Anastasia Xydou

In the ITER Tokamak, four Electron Cyclotron Heating Upper Launchers (ECHUL) are needed to control plasma instabilities at the rational surfaces, most importantly the q = 3/2 and q = 2/1 neoclassical tearing modes (NTMs). Each ECHUL is equipped with a set ...

2023

Experimental study of the hydrodynamic and thermal performances of ventilated wall structures

Dolaana Khovalyg, Mohammad Rahiminejad

The presence of a ventilated air gap behind the external cladding in a building envelope is known to have a tangible contribution to the overall performance of the wall assembly. In the present study, the hydrodynamic and thermal performances of ventilated ...

2023

Influence of outdoor air pollution on European residential ventilative cooling potential

Dusan Licina, Evangelos Belias

Residential ventilative cooling via natural ventilation is influenced by outdoor air pollution. However, relative to climate, outdoor air pollution is not comprehensively considered in determining the ventilative cooling potential of buildings. To assess t ...

ELSEVIER SCIENCE SA2023

Inter-actions parallel execution on GPU from high-level dataflow synthesis

Marco Mattavelli, Simone Casale Brunet, Aurélien François Gilbert Bloch

Recent GPU architectures make available numbers of parallel processing units that exceed by orders of magnitude the ones offered by CPU architectures. Whereas programs written using dataflow programming languages are well suited for programming heterogeneo ...

IEEE2022

Near-junction microfluidic cooling for high power-density GaN-on-Si electronics: A wafer, device, packaging, and system-level investigation

Remco Franciscus Peter van Erp

Electrification of the energy section, from generation to end-use, plays an essential role in reducing global CO2 emission. Innovations in power electronics are required to increase conversion efficiency and power density. Gallium nitride (GaN) transistors ...

EPFL2022

Field evaluation of thermal and acoustical comfort in eight North-American buildings using embedded radiant systems

Caroline Karmann

We performed a post-occupancy assessment based on 500 occupant surveys in eight buildings using embedded radiant heating and cooling systems. This study follows-up on a quantitative assessment of 60 office buildings that found radiant and all-air buildings ...

2021

Dynamic Thermal Management with Proactive Fan Speed Control Through Reinforcement Learning

David Atienza Alonso, Marina Zapater Sancho, Arman Iranfar, Federico Terraneo, Gabor Andras Csordas

Dynamic Thermal Management (DTM) has become a major challenge since it directly affects Multiprocessors Systems-on-chip (MPSoCs) performance, power consumption, and reliability. In this work, we propose a transient fan model, enabling adaptive fan speed co ...

IEEE2020

GPU-accelerated data management under the test of time

Anastasia Ailamaki, Syed Mohammad Aunn Raza, Periklis Chrysogelos, Angelos Christos Anadiotis, Panagiotis Sioulas

GPUs are becoming increasingly popular in large scale data center installations due to their strong, embarrassingly parallel, processing capabilities. Data management systems are riding the wave by using GPUs to accelerate query execution, mainly for analy ...

2020

Programming Heterogeneous CPU-GPU Systems by High-Level Dataflow Synthesis

Marco Mattavelli, Endri Bezati, Aurélien François Gilbert Bloch

Heterogeneous processing platforms combining in various architectures CPUs, GPUs, and programmable logic, are continuously evolving providing at each generation higher theoretical levels of computing performance. However, the challenge of how efficiently s ...

IEEE2020

Embedded Microchannel Cooling for High Power-Density GaN-on-Si Power Integrated Circuits

Elison de Nazareth Matioli, Remco Franciscus Peter van Erp, Luca Nela, Georgios Kampitsis, Reza Soleiman Zadeh Ardebili

In this work, we demonstrate a new thermal management approach for direct cooling of GaN-on-Si power integrated circuits (ICs), in which the Si substrate functions as a microfluidic heat sink, turning Si into a cost-effective, high thermal performance subs ...

IEEE2020