Concept

Semiconductor fabrication plant

Publications associées (357)

Fabrication and characterization of wafer-level deep TSV arrays

Michail Zervas, Yusuf Leblebici, Yüksel Temiz

Three Dimensional (3D) integration, based on through silicon vias (TSV), has the potential to become a key enabling technology for many applications. TSVs are commonly categorized according to their aspect ratio and diameter. An equally important parameter ...

IEEE2012

Vibration energy harvester on plastic foil based on transferring PZT thick sheets with dry film photoresist

Nico de Rooij, Danick Briand, Jinyu Jason Ruan, Andres Felipe Vasquez Quintero, Pattanaphong Janphuang, Robert Andrew Lockhart

This paper presents a low-complexity and low temperature (85°C) fabrication process for vibration energy harvesters. The process employs lamination steps to transfer thinned PZT thick sheets onto flexible polymeric substrates, using dry film photoresist. T ...

2012

Vibration Energy Harvesters On Plastic Foil By Lamination Of Pzt Thick Sheets

Nico de Rooij, Danick Briand, Jinyu Jason Ruan, Andres Felipe Vasquez Quintero, Pattanaphong Janphuang, Robert Andrew Lockhart

This paper presents a low-complexity and low temperature (85 degrees C) fabrication process for vibration energy harvesters. The process employs lamination steps to transfer thinned PZT thick sheets onto flexible polymeric substrates, using dry film photor ...

Ieee2012

Fast on-wafer electrical, mechanical, and electromechanical characterization of piezoresistive cantilever force sensors

Luis Guillermo Villanueva Torrijo

Validation of a technological process requires an intensive characterization of the performance of the resulting devices, circuits, or systems. The technology for the fabrication of micro and nanoelectromechanical systems (MEMS and NEMS) is evolving rapidl ...

2012

Amorphous silicon-based microchannel plates

Christophe Ballif, Sylvain Dunand, Yannick Samuel Riesen, François Eric Powolny, Andrea Franco

Microchannel plates (MCP) based on hydrogenated amorphous silicon (a-Si:H) were recently introduced to overcome some of the limitations of crystalline silicon and glass MCP. The typical thickness of a-Si:H based MCPs (AMCP) ranges between 80 and 100 μm and ...

Elsevier Science Bv2012

MicroThrust MEMS electrospray emitters – integrated microfabrication and test results

Herbert Shea, Caglar Ataman, Simon Dandavino, Subha Chakraborty

With the growth of interest in small satellites (

2012

3D Integration Technology for Lab-on-a-Chip Applications

Yüksel Temiz

This study adds a new dimension to lab-on-a-chip systems by employing three-dimensional (3D) integration technology for improved performance, higher functionality, and on-chip computational power. Despite the extensive amount of current research on 3D memo ...

EPFL2012

Inkjet Printing of Interdigitated Capacitive Chemical Sensors with Reduced Size by the Introduction of a Dielectric Interlayer

Nico de Rooij, Danick Briand, Francisco Molina Lopez

A new fabrication strategy is proposed to reduce the size of sensors based on inkjet-printed interdigitated electrodes (IDE). The process is compatible with fabrication at low temperature and can be applied to flexible organic foils. The new fabrication co ...

Elsevier Science Bv2012

Inkjet Printing of Interdigitated Capacitive Chemical Sensors with Reduced Size by the Introduction of a Dielectric Interlayer

Nico de Rooij, Danick Briand, Francisco Molina Lopez

Elsevier Science Bv2012

Highly ordered palladium nanodot patterns for full concentration range hydrogen sensing

Jürgen Brugger, Luis Guillermo Villanueva Torrijo, Thomas Kiefer

A hydrogen sensor based on a novel fabrication process that combines the precision of advanced nano-fabrication techniques with a bottom-up process based on electrochemistry is presented. The sensor allows for reliable detection between 0.1% and 100% of H2 ...

2012

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