Publications associées à Packaging engineering

Tunable biocomposite films fabricated using cellulose nanocrystals and additives for food packaging

Cellulose nanocrystals (CNCs) are considered a prospective packaging material to partially replace petroleumbased plastics attributed to their renewability, sustainability, biodegradability, and desirable attributes including transparency, oxygen, and oil ...

ELSEVIER SCI LTD2023

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Linear and nonlinear applications of miniaturized silicon nitride microresonators

Arslan Sajid Raja

Photonic integrated circuits (PICs) are the subject of massive interest due to the range of applications they can provide at a huge scale while building on well-established CMOS technologies. One of the critical parameters defining a technology's maturity ...

EPFL2023

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi, Göran Stemme

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Reliability Aspects of Microelectromechanical Systems for Space Applications : Mechanical Properties of Structural Materials and Analysis of Packaging Strains

Tobias Bandi

Microelectromechanical systems (MEMS) are an essential ingredient in many technological innovations and a source of game-changing inventions in the automotive industry, space exploration, consumer electronics and medical applications due to its capability ...

EPFL2014

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

Nico de Rooij, Danick Briand, Yves Pétremand

This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...

Institute of Physics2013

An analysis of destination choice for opaque airline products using multidimensional binary logit models

Michel Bierlaire, Alexandre Khelifa

We investigate how customers respond to an opaque airline product offered by a European carrier. In this opaque product design, customers are randomly assigned to travel to one of approximately ten destinations; however, for a fee they may exclude one or m ...

Pergamon-Elsevier Science Ltd2012

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater

An innovative multifunctional LTCC module has been designed for miniature atomic clock packaging. The components of miniature atomic clocks need to be efficiently packaged and connected to each other, and a precise temperature control is required for them. ...

Trans Tech Publications2012

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater

An innovative multifunctional LTCC module has been designed for miniature atomic clock packaging. The components of miniature atomic clocks need to be efficiently packaged and connected to each other, and a precise temperature control is required for them. ...

Trans Tech Publications Ltd2012

Development of Low-Cost 24-GHz Circuits Exploiting System-in-Package (SiP) Approach and Commercial PCB Technology

Gabriele Tasselli

This paper deals with 24-GHz circuits developed by exploiting a system-in-package approach. In order to reduce the cost as much as possible, a standard multilayer printed circuit board (PCB) technology has been adopted. Such a circuit consists of a package ...

Institute of Electrical and Electronics Engineers2012