Publications associées à Packaging engineering

Characterisation of test vehicle for in-situ measurement of die attach thermal conductivity

Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater

The continuing trend in the automotive and aviation industries to reduce complexity of electronic systems by removing cooling results in a need for high temperature electronics and associated packaging technologies. To ensure reliability over long periods ...

IMAPS / ACerS2012

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater

An innovative multifunctional LTCC module has been designed for miniature atomic clock packaging. The components of miniature atomic clocks need to be efficiently packaged and connected to each other, and a precise temperature control is required for them. ...

Trans Tech Publications2012

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater

Trans Tech Publications Ltd2012

Development of Low-Cost 24-GHz Circuits Exploiting System-in-Package (SiP) Approach and Commercial PCB Technology

Gabriele Tasselli

This paper deals with 24-GHz circuits developed by exploiting a system-in-package approach. In order to reduce the cost as much as possible, a standard multilayer printed circuit board (PCB) technology has been adopted. Such a circuit consists of a package ...

Institute of Electrical and Electronics Engineers2012

An evaluation of thick-film silver die-attach as micro solid oxide fuel cells (μ-SOFCs) interconnection packaging

Paul Muralt, Thomas Maeder, Bo Jiang

Micro solid oxide fuel cells (μ-SOFCs) based on MEMS fabrication processes have become an increasingly attractive option for portable power generation applications, due to their high power density and their compatibility with hydrocarbon fuels. For system ...

IMAPS / ACerS2012

Nonparametric Construction of Multivariate Kernels

Victor Panaretos, Kjell Konis

We propose a nonparametric method for constructing multivariate kernels tuned to the configuration of the sample, for density estimation in R-d, d moderate. The motivation behind the approach is to break down the construction of the kernel into two parts: ...

American Statistical Association2012

Foil level packaging of a chemical gas sensor

Nico de Rooij, Danick Briand, Jérôme Courbat

A generic method for the packaging of transducers at the foil level is proposed and was demonstrated on chemical gas sensors made on a plastic foil. The processing was based on the lamination of pre-patterned polymeric structures on the fabricated devices ...

Institute of Physics2010

0-level Vacuum Packaging RT Process for MEMS Resonators

Mihai Adrian Ionescu, Cyrille Hibert, Daniel Grogg, Nicolas Abelé

A new Room Temperature (RT) 0-level vacuum package is demonstrated in this work, using amorphous silicon (aSi) as sacrificial layer and SiO2 as structural layer. The process is compatible with most of MEMS resonators and Resonant Suspended-Gate MOSFET [1] ...

2008

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Packaging engineering

Characterisation of test vehicle for in-situ measurement of die attach thermal conductivity

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Development of Low-Cost 24-GHz Circuits Exploiting System-in-Package (SiP) Approach and Commercial PCB Technology

An evaluation of thick-film silver die-attach as micro solid oxide fuel cells (μ-SOFCs) interconnection packaging

Nonparametric Construction of Multivariate Kernels

Implantable Antennas for Biomedical Applications

Foil level packaging of a chemical gas sensor

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

0-level Vacuum Packaging RT Process for MEMS Resonators

Graph Chatbot

Chattez avec Graph Search

Implantable Antennas for Biomedical Applications

Development of Low-Cost 24-GHz Circuits Exploiting System-in-Package (SiP) Approach and Commercial PCB Technology

An evaluation of thick-film silver die-attach as micro solid oxide fuel cells (μ-SOFCs) interconnection packaging

Foil level packaging of a chemical gas sensor

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Nonparametric Construction of Multivariate Kernels

0-level Vacuum Packaging RT Process for MEMS Resonators

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Characterisation of test vehicle for in-situ measurement of die attach thermal conductivity