Laserthumb|250px|Lasers rouges (660 & ), verts (532 & ) et bleus (445 & ). thumb|250px|Rayon laser à travers un dispositif optique. thumb|250px|Démonstration de laser hélium-néon au laboratoire Kastler-Brossel à l'Université Pierre-et-Marie-Curie. Un laser (acronyme issu de l'anglais light amplification by stimulated emission of radiation qui signifie « amplification de la lumière par émission stimulée de radiation ») est un système photonique.
Laser engravingLaser engraving is the practice of using lasers to engrave an object. Laser marking, on the other hand, is a broader category of methods to leave marks on an object, which in some cases, also includes color change due to chemical/molecular alteration, charring, foaming, melting, ablation, and more. The technique does not involve the use of inks, nor does it involve tool bits which contact the engraving surface and wear out, giving it an advantage over alternative engraving or marking technologies where inks or bit heads have to be replaced regularly.
Laser safetyLaser radiation safety is the safe design, use and implementation of lasers to minimize the risk of laser accidents, especially those involving eye injuries. Since even relatively small amounts of laser light can lead to permanent eye injuries, the sale and usage of lasers is typically subject to government regulations. Moderate and high-power lasers are potentially hazardous because they can burn the retina, or even the skin.
Diode laserUne diode laser est un composant opto-électronique à base de matériaux semi-conducteurs. Elle émet de la lumière monochromatique cohérente (une puissance optique) destinée, entre autres, à transporter un signal contenant des informations sur de longues distances (dans le cas d'un système de télécommunications) ou à apporter de l'énergie lumineuse pour le pompage de certains lasers (lasers à fibre, laser DPSS) et amplificateurs optiques (OFA, Optical Fiber Amplifier).
Laser drillingLaser drilling is the process of creating thru-holes, referred to as “popped” holes or “percussion drilled” holes, by repeatedly pulsing focused laser energy on a material. The diameter of these holes can be as small as 0.002” (~50 μm). If larger holes are required, the laser is moved around the circumference of the “popped” hole until the desired diameter is created. Laser drilling is one of the few techniques for producing high-aspect-ratio holes—holes with a depth-to-diameter ratio much greater than 10:1.