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The deformation mechanisms of silicon {001} surfaces during nanoscratching were found to depend strongly on the loading conditions. Nanoscratches with increasing load were performed at 2 μm/s (low velocity) and 100 μm/s (high velocity). The load-penetratio ...
During nanoindentation measurements of thin films the formation of cracks within the film as well as of pile-up or sink-in around the indent are known to affect significantly the precision of hardness and Young's modulus values. The crack pattern in brittl ...
Scratch experiments have been used in the past to investigate various contact phenomena such as abrasion mechanisms or asperity contacts. Depending on tip geometries, loading conditions and materials investigated, different crack propagation modes (radial ...
In this paper we present our latest developments in high precision positioning and handling systems operating inside an SEM. The Laboratory in Scanning Electron Microscope concept (LAB-in-SEM) is proposed along with a description of our piezodriven manipul ...
