Publications de Peter Ryser | EPFL Graph Search

Enhanced tunneling conductivity induced by gelation of attractive colloids

Peter Ryser, Claudio Grimaldi, Francesco Varrato, Giuseppe Foffi, Biagio Nigro

We show that the formation of a gel by conducting colloidal particles leads to a dramatic enhancement in bulk conductivity, due to interparticle electron tunneling, combining predictions from molecular-dynamics simulations with structural measurements in a ...

Amer Physical Soc2013

Magnetically tuneable thermoplastic resistive composites

Peter Ryser, Thomas Maeder, Caroline Jacq

Depending on the materials and processing parameters, composite materials consisting of an insulating matrix and a conductive filler may be electrically insulating, resistive or conducting. Previously, we had manufactured composites consisting of a resin a ...

Vysoké učení technické v Brně (VUT-Br), Antonínská 548/12013

Tunneling conductivity in composites of attractive colloids

Peter Ryser, Claudio Grimaldi, Biagio Nigro

In conductor-insulator nanocomposites in which conducting fillers are dispersed in an insulating matrix, the electrical connectedness is established by inter-particle tunneling or hopping processes. These systems are intrinsically non-percolative and a coh ...

American Institute of Physics2012

Tunneling and percolation transport regimes in segregated composites

Peter Ryser, Claudio Grimaldi, Biagio Nigro

We consider the problem of electron transport in segregated conductor-insulator composites in which the conducting particles are connected to all others via tunneling conductances, thus forming a global tunneling-connected resistor network. Segregation is ...

2012

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater

An innovative multifunctional LTCC module has been designed for miniature atomic clock packaging. The components of miniature atomic clocks need to be efficiently packaged and connected to each other, and a precise temperature control is required for them. ...

Trans Tech Publications2012

Test Vehicle for Studying Thermal Conductivity of Die Attach Adhesives for High Temperature Electronics

Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater

Polymer adhesives offer a viable method for mounting silicon dies for high temperature applications. Here a test vehicle for comparing the thermal conductivity of different die attach materials is presented. The setup can be used to determine the degree of ...

Trans Tech Publications Ltd2012

Thermal characterization of an LTCC module for miniature atomic clock packaging

Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater

This paper presents the design and thermal characterization of a 15 × 22 mm2 LTCC module dedicated to the packaging of the elements of a miniature atomic clock. This module acts as a carrier for the components of the clock as well as temperature controller ...

IMAPS / ACerS2012

Characterisation of test vehicle for in-situ measurement of die attach thermal conductivity

Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater

The continuing trend in the automotive and aviation industries to reduce complexity of electronic systems by removing cooling results in a need for high temperature electronics and associated packaging technologies. To ensure reliability over long periods ...

IMAPS / ACerS2012

Long-term mechanical reliability of ceramic thick-film circuits and mechanical sensors under static load

Peter Ryser, Thomas Maeder, Caroline Jacq

In this work, we study the long-term mechanical strength under static load - i.e. static fatigue performance or resistance to subcritical crack growth - of ceramic thick-film circuits, namely how the static fatigue of the substrate is affected by the prese ...

Elsevier2012

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Peter Ryser

Enhanced tunneling conductivity induced by gelation of attractive colloids

Magnetically tuneable thermoplastic resistive composites

LTCC for integrated sensor-device applications

Tunneling conductivity in composites of attractive colloids

Tunneling and percolation transport regimes in segregated composites

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Test Vehicle for Studying Thermal Conductivity of Die Attach Adhesives for High Temperature Electronics

Thermal characterization of an LTCC module for miniature atomic clock packaging

Characterisation of test vehicle for in-situ measurement of die attach thermal conductivity

Long-term mechanical reliability of ceramic thick-film circuits and mechanical sensors under static load

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Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Test Vehicle for Studying Thermal Conductivity of Die Attach Adhesives for High Temperature Electronics

Magnetically tuneable thermoplastic resistive composites

Characterisation of test vehicle for in-situ measurement of die attach thermal conductivity

Tunneling and percolation transport regimes in segregated composites

Long-term mechanical reliability of ceramic thick-film circuits and mechanical sensors under static load

Enhanced tunneling conductivity induced by gelation of attractive colloids

LTCC for integrated sensor-device applications

Tunneling conductivity in composites of attractive colloids

Thermal characterization of an LTCC module for miniature atomic clock packaging