Augusto Ronchini Ximenes

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A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology

Edoardo Charbon, Myung Jae Lee, Preethi Padmanabhan, Augusto Ronchini Ximenes

This article introduces a modular, direct time-of-flight (TOF) depth sensor. Each module is digitally synthesized and features a 2

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\times

8) single-photon avalanche diode (SPAD) pixel array, an edge-sensitive decision tree, a shared time-to-digital converter (TDC), 21-bit per-pixel memory, and in-locus data processing. Each module operates autonomously, by internal data acquisition, management, and storage, being periodically read out by an external access. The prototype was fabricated in a TSMC 3-D-stacked 45/65-nm CMOS technology, featuring backside illumination (BSI) SPAD detectors on the top tier, and readout circuit on the bottom tier. The sensor was characterized by single-point measurements, in two different modes of resolution and range. In low-resolution mode, a maximum of 300-m and 80-cm accuracy was recorded; on the other hand, in high-resolution mode, the maximum range and accuracy were 150 m and 7 cm, respectively. The module was also used in a flexible scanning light detection and ranging (LiDAR) system, where a 256

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256 depth map, with millimeter precision, was obtained. A laser signature based on pulse-position modulation (PPM) is also proposed, achieving a maximum of 28-dB interference reduction.

2019

Oscillator arrangement for time-to-digital converter for large array of time-of-flight image sensor devices

Edoardo Charbon, Preethi Padmanabhan, Augusto Ronchini Ximenes

An oscillator arrangement for time-to-digital converters for a 3D image sensor device includes a plurality of oscillators arranged as an array each oscillator being associated to one time-to-digital converter, and at least one coupling unit respectively arranged between at least two of the oscillators, so that oscillation in the at least two oscillators at a fundamental frequency is synchronized between the at least two coupled oscillators.

2019

A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology

Edoardo Charbon, Myung Jae Lee, Preethi Padmanabhan, Augusto Ronchini Ximenes

This article introduces a modular, direct time-of-flight (TOF) depth sensor. Each module is digitally synthesized and features a 2

\times

\times

\times

256 depth map, with millimeter precision, was obtained. A laser signature based on pulse-position modulation (PPM) is also proposed, achieving a maximum of 28-dB interference reduction.

2019

A 256x128 3D-Stacked (45nm) SPAD FLASH LiDAR with 7-Level Coincidence Detection and Progressive Gating for 100m Range and 10klux Background Light

A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology

Oscillator arrangement for time-to-digital converter for large array of time-of-flight image sensor devices

A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology

A 256x128 3D-Stacked (45nm) SPAD FLASH LiDAR with 7-Level Coincidence Detection and Progressive Gating for 100m Range and 10klux Background Light

Oscillator arrangement for time-to-digital converter for large array of time-of-flight image sensor devices