Publications de Simone Frasca | EPFL Graph Search

Observation of first- and second-order dissipative phase transitions in a two-photon driven Kerr resonator

Vincenzo Savona, Pasquale Scarlino, Fabrizio Minganti, Simone Frasca, Guillaume Beaulieu

In open quantum systems, dissipative phase transitions (DPTs) emerge from the interplay between unitary evolution, drive, and dissipation. While second-order DPTs have been predominantly investigated theoretically, first-order DPTs have been observed in si ...

2025

Criticality-Enhanced Quantum Sensing with a Parametric Superconducting Resonator

Pasquale Scarlino, Fabrizio Minganti, Simone Frasca, Marco Scigliuzzo, Guillaume Beaulieu

Quantum metrology, a cornerstone of quantum technologies, exploits entanglement and superposition to achieve higher precision than classical protocols in parameter-estimation tasks. When combined with critical phenomena such as phase transitions, the diver ...

American Physical Society (APS)2025

High kinetic inductance cavity arrays for compact band engineering and topology-based disorder meters

Pasquale Scarlino, Simone Frasca, Marco Scigliuzzo, Guillaume Beaulieu, Vincent Jean Yves Jouanny, Fabian Oppliger

Superconducting microwave metamaterials offer enormous potential for quantum optics and information science, enabling the development of advanced quantum technologies for sensing and amplification. In the context of circuit quantum electrodynamics, such me ...

2025

Three-wave-mixing quantum-limited kinetic inductance parametric amplifier operating at 6 T near 1 K

Pasquale Scarlino, Simone Frasca, Guillaume Beaulieu, Camille René Charles Roy

Parametric amplifiers play a crucial role in modern quantum technology by enabling the enhancement of weak signals with minimal added noise. Traditionally, Josephson junctions have been the primary choice for constructing parametric amplifiers. Nevertheles ...

American Physical Society (APS)2024

NbN films with high kinetic inductance for high-quality compact superconducting resonators

Edoardo Charbon, Pasquale Scarlino, Fabrizio Minganti, Simone Frasca, Marco Scigliuzzo, Vincent Jean Yves Jouanny, Fabian Oppliger, Roberto Musio

Niobium nitride (NbN) is a particularly promising material for quantum technology applications, as it shows the degree of reproducibility necessary for large-scale superconducting circuits. We demonstrate that resonators based on NbN thin films present a o ...

American Physical Society (APS)2023

High-Kinetic Inductance Superconducting Technology for Quantum Applications

Simone Frasca

Superconducting materials present unique properties, which make a potential technological platform based on superconductors extremely appealing for a wide set of applications, both classical and not. Among these classes of materials, high-kinetic inductanc ...

EPFL2023

The effect of size, orientation and temperature on the deformation of microcast silver crystals

Edoardo Charbon, Andreas Mortensen, Simone Frasca, Luciano Borasi

Monocrystalline microwires of silver are produced by means of a novel casting process that combines precise mold production by silicon microfabrication with molten metal pressure infiltration. The wires have a shape amenable to tensile testing and a diamet ...

PERGAMON-ELSEVIER SCIENCE LTD2023

Coupling silicon lithography with metal casting

Edoardo Charbon, Andreas Mortensen, Simone Frasca, Luciano Borasi

Micron-scale shaped 2D or 2.5D structures made of silver or copper can be produced by combining silicon photolithographic etching with metal casting by pressure infiltration. This combination of two classical pro-cesses, one from semiconductor fabrication ...

2022

The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias

Edoardo Charbon, Sandro Carrara, Simone Frasca, Rebecca Camilla Leghziel

We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufacturin ...

Nature Research2021

System and method for removing scalloping and tapering effects in high aspect ratio through-silicon vias of wafers

Edoardo Charbon, Sandro Carrara, Simone Frasca, Rebecca Camilla Leghziel

A method for manufacturing vias in a silicon wafer, the silicon wafer having a crystal orientation, and having a plane that is perpendicular to a surface of the wafer, tilted by 35.26°, the method comprising the steps of providing a mask having ...

2021