Saturated critical heat flux in a multi-microchannel heat sink fed by a split flow system
Graph Chatbot
Chattez avec Graph Search
Posez n’importe quelle question sur les cours, conférences, exercices, recherches, actualités, etc. de l’EPFL ou essayez les exemples de questions ci-dessous.
AVERTISSEMENT : Le chatbot Graph n'est pas programmé pour fournir des réponses explicites ou catégoriques à vos questions. Il transforme plutôt vos questions en demandes API qui sont distribuées aux différents services informatiques officiellement administrés par l'EPFL. Son but est uniquement de collecter et de recommander des références pertinentes à des contenus que vous pouvez explorer pour vous aider à répondre à vos questions.
The heat transfer performance of commercially produced micro-enhanced tubes with and without a nanocoating was investigated under pool boiling of saturated refrigerant. These multiscale enhancements were on the outside of 19 mm horizontal copper tubes heat ...
Pool boiling has a high heat removal capability and is considered as one of the most effective cooling methods due to utilization of latent heat of vaporization. Surface wettability plays a key role in boiling heat transfer since it controls the contact li ...
2019
Heat exchangers are key components of energy conversion systems, including HVAC&R equipment. The compact microchannel design of a heat exchanger (MCHX) allows for significant reduction of its volume, weight, and raw material, in comparison to conventional ...
University of Illinois at Urbana-Champaign2017
, ,
The development of newer and more efficient cooling techniques to sustain the increasing power density of high-performance computing systems is becoming one of the major challenges in the development of microelectronics. In this framework, two-phase coolin ...
Asme2017
High temperature heat pumps (HTHPs) with heat sink temperatures in the range of 100 to 160°C are expected to become increasingly commercialized in the coming years. Major applications have been identified, particularly in the food, paper, metal and chemica ...
2018
Plate heat exchangers are adopted in many domestic and industrial applications, such as ventilation, air conditioning, evaporation or condensation process, heat pumps and cooling of hydrodynamic circuits in engines. In the present thesis, an extensive expe ...
Emerging applications in new generation electronic devices require effective heat removal and thermal man-agement. In this regard, boiling is a phase change phenomenon capable of dissipating a large amount of heat compared to the sensible heat. In this stu ...
High-energy physics (HEP) experiments and space missions share a common challenge: thermal management in harsh environments. The severe constraints in both fields make cooling of electronic components a major design concern. This thesis aims to develop hig ...
Cooling the new generation of 3D high power electronic chips is one of the leading challenges in microelectronics, as it is a key to achieve high computational performance at lower cooling system power consumption, thus reducing the operating cost. Two-pha ...
The global tendency towards miniaturization driven by the microelectronics industry is pushing system density and packaging towards unprecedented values of thermal design power, with a dramatic reduction of the surface area of the devices. Vertical integra ...
