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Stencil lithography is an innovative method for patterning that has a great flexibility from many points of view. It is based on shadow mask evaporation using thin silicon nitride membranes that allow the patterning of sub-100 nm features up to 100 μm in a ...
Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...
This paper describes Si-micromachined two-axis beam- steering micromirrors and their performance in 256 x 256- and 1024 x 1024-port large optical cross-connects (OXCs). The high-reflectivity wavelength-independent mirrors are electrostatically actuated; ca ...
Low Temperature Co-fired Ceramic (LTCC) Technology is recentlyaddressed to be a key approach among advanced packaging technologies, offering many advantages over its competitors. One of its most attractivefeatures is the ease of 3-D structuration thanks to ...
