Process-induced skew variation for scaled 2-D and 3-D ICs
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Technology scaling improves the energy, performance, and area of the digital circuits. With further scaling into sub-45nm regime, we are moving toward very low supply (VDD) and threshold voltages (VT), smaller VDD/VT ratio, high leakage current, and large ...
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Global interconnect design for threedimensional integrated circuits is a crucial task. Despitethe importance of this task, limited results related to global issues have been presented. Challenges in reliably distributing power, ground, and the clock signal ...
Wireless communications are showing an explosive growth in emerging consumer and military applications of radiofrequency (RF), microwave, and millimeter-wave circuits and systems. Applications include wireless personal connectivity (Bluetooth), wireless lo ...
For the past couple of decades the desire to add more complexity to a computer chip, while simultaneously reducing the cost per bit, has been accommodated by down-scaling. This approach has been extremely successful in the past, but like all good things it ...
We study proton diffusion in amorphous SiO2 and hafnium silicates at the atomic scale. In amorphous SiO2, ab initio molecular dynamics suggest that the dominant atomic process consists in cross-ring interoxygen hopping assisted by network vibrations. In ha ...
The power efficiency of source-coupled logic (SCL) topology for implementing ultra-low-power and low-activity-rate circuits is investigated. It is shown that in low-activity-rate circuits, where the subthreshold leakage consumption of conventional CMOS cir ...