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Thermal Analysis of the advanced single-stage planar actuator

Publications associées (61)

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On The Heat Transfer Of Holographic Type In Nanostructures

Maria-Alexandra Paun

Assimilating any nanostructure with a fractal, in the most general Mandelbrot's sense, non - differentiable behaviors in their dynamics on the heat transfer phenomena are analyzed. As such, nanostructure dynamics on the heat transfer in the form of Schrodi ...

UNIV POLITEHNICA BUCHAREST, SCI BULL2020

Heterogeneous materials are used in a wide range of applications involving high heat flux environments such as concentrated solar reactors, high-temperature furnaces, or thermal protection systems of space vehicles. The thermal response of heterogeneous ma ...

EPFL2019

Narrow Impingement Channels: Recent Advancements and Future Directions

Peter Ott, Alexandros Terzis, Michele Gaffuri

This paper summarizes the state-of-the-art related to the heat transfer characteristics of narrow impingement cooling channels, which can nowadays be integrated within the external wall of turbine airfoils. Particular emphasis is given to the experimental ...

European Turbomachinery Society2019

Thermal Interface Material Enablement of Off-Board Two-Phase Cooling

John Richard Thome, Raffaele Luca Amalfi

Two-phase, refrigerant-based cooling offers significant promise for increasing heat densities and energy efficiencies of electronic components. One barrier to wide spread adoption of two-phase cooling solutions is preserving product features deemed essenti ...

IEEE2018

Experimental evaluation of the thermal performances of a thermosyphon cooling system rejecting heat by natural and forced convection

John Richard Thome, Filippo Cataldo

In the present paper, a closed-loop thermosyphon cooling system for power electronics has been developed and tested. The evaporator is a multi-microchannel heat sink designed for high heat fluxes. The power electronics module is emulated by four independen ...

Pergamon-Elsevier Science Ltd2017

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

John Richard Thome, Mirco Magnini, Chiara Falsetti

The development of newer and more efficient cooling techniques to sustain the increasing power density of high-performance computing systems is becoming one of the major challenges in the development of microelectronics. In this framework, two-phase coolin ...

Asme2017

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Cooling the new generation of 3D high power electronic chips is one of the leading challenges in microelectronics, as it is a key to achieve high computational performance at lower cooling system power consumption, thus reducing the operating cost. Two-pha ...

Pergamon-Elsevier Science Ltd2017

Numerical Quantification of Coupling Effects for Radiation-Conduction Heat Transfer in Participating Macroporous Media: Investigation of a Model Geometry

Sophia Haussener, David Yann Samuel Perraudin

Radiative-conductive heat transfer in porous media is usually investigated by decoupling the heat transfer modes and solving the volume-averaged continuum equations using effective transport properties. However, both modes are naturally coupled and couplin ...

Elsevier2017

Innovative low-mass cooling systems for the ALICE ITS Upgrade detector at CERN

Manuel Gómez Marzoa

The Phase-1 upgrade of the LHC to full design luminosity, planned for 2019 at CERN, requires the modernisation of the experiments around the accelerator. The Inner Tracking System (ITS), the innermost detector at the ALICE experiment, will be upgraded by r ...

EPFL2016

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This paper is the third part of the present study on two-phase mini-thermosyphon cooling systems. As mentioned in the first two parts, gravity-driven cooling systems using microchannel flow boiling are a very promising long-term viable solution for electro ...

Ieee2016