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Ferritic/martensitic steels are candidate materials for fusion reactor structural components, liquid metal containers of spallation neutron sources, and accelerator driven systems, with good radiation resistance and thermo-mechanical properties. However, e ...
EPFL2015
Limestone in volcanic basements has been identified as a hazard in terms of edifice stability due to the propensity of calcite to decompose into lime and CO2 at high temperatures (>600 °C), causing a decrease in mechanical strength. To date, such hypoth ...
Various thermo-mechanical treatments were applied to refine and homogenise grain size and improve mechanical properties of hot-isostatically pressed (HIP) 14%Cr ODS ferritic steel. The grain size was reduced, improving mechanical properties, tensile streng ...
The production of reactivated cementitious materials is an option for the recycling of hydrated-cement-rich fines discarded during recycled aggregate production. Reactivation is based on a thermal process where calcium silicate hydrates present in the fine ...
2015
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An oxide dispersion strengthened ODS ferritic steel has been produced by mechanical alloying of Fe–14Cr–2W–0.2Ti (wt.%) prealloyed powder with 0.55 (wt.%) Fe2Y intermetallic particles and consolidated by hot isostatic pressing. The microstructure after the ...
2016
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In this paper, a simple but realistic approach is presented to predict the as-quenched residual stress distribution in thick 7xxx aluminium alloy plates. Instead of modelling precipitation that occurs during quenching, a thermo-mechanical model is used who ...
The microstructural changes occurring during drawing and ageing in pearlitic steel wires have been studied using the thermoelectric power (TEP) measurements combined with atom probe tomography (APT) and differential scanning calorimetry (DSC). APT analysis ...
The a/c domain pattern of tetragonal PbZr0.10Ti0.90O3 thin films under tensile misfit strain is investigated by piezoresponse force microscopy and X-ray diffraction. The results show a hierarchical ordering of the dense a/c domain structure into larger sup ...
This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...
We present a process for the production of Cu-Al matrix composites containing between 25 and 30 vol.% in situ Al2O3. The composites are prepared by pressing, heat-treating and hot working blended powders of Cu, Al and CuO packed into copper alloy cans. The ...