Self-Aligned 3D Chip Integration Technology and Through-Silicon Serial Data Transmission
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Modern communication devices demand challenging specifications in terms of miniaturization, performance, power consumption and cost. Every new generation of radio frequency integrated circuits (RF-ICs) offer better functionality at reduced size, power cons ...
As dictated by ongoing technology scaling and the advent of multi-core systems, each new generation of microprocessors and digital signal processors provides higher computing power and data throughput. However, the available bandwidth of the input/output ( ...
The design of today's semiconductor chips for various applications, such as telecommunications, poses various challenges due to the complexity of these systems. These highly complex systems-on-chips demand new approaches to connect and manage the communica ...
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We have designed a wafer level chip scale package for a bi-stable SOI-MEMS dc switch using a silicon-glass hermetic seal with through the lid feedthroughs. Bonded at 365 °C, 230 V and 250 kg, they pass the fine/gross leak test after thermal cycling and mec ...
We report the development of piezoresistive cantilevers for intermolecular force detection in biochemical sensing, by using a commercial CMOS technology. The detection of the small forces involved in molecular recognition requires cantilevers with a small ...
We report the development of piezoresistive cantilevers for intermolecular force detection in biochemical sensing, by using a commercial CMOS technology. The detection of the small forces involved in molecular recognition requires cantilevers with a small ...
We report the development of piezoresistive cantilevers for intermolecular force detection in biochemical sensing, by using a commercial CMOS technology. The detection of the small forces involved in molecular recognition requires cantilevers with a small ...
Information technology has only been around for about fifty years. Although the beginnings of automatic calculation date from as early as the 17th century (W. Schickard built the first mechanical calculator in 1623), it took the invention of the transistor ...
We demonstrate high-performance nanowire superconducting single photon detectors (SSPDs) on bN thin films grown at a temperature compatible with monolithic integration. NbN films ranging from 150nm to 3nm in thickness were deposited by dc magnetron sputter ...
