Deformation of (Mg-0.9,Fe-0.1)SiO3 Perovskite aggregates up to 32 GPa
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The project aims to validate some recent theoretical developments on the deformation twinning nucleation mechanism in HCP metals through small-scale mechanic experiments. To this end, a systematic investigation of the mechanical response of pure magnesium ...
The microcasting process is a scaled-down investment casting process in which molten metal is pressure-infiltrated and directionally solidified in water-soluble moulds. It was previously developed to produce metallic microwires with a diameter (D) between ...
Monocrystalline, cast aluminium microwires of diameter (D) below 25 mu m free of micromilling artefacts are annealed under protective atmosphere. Annealing increases the flow stress of all tested microwires, by an amount that is found, in a Haasen plot of ...
Nanocrystalline (NC) metals have attracted widespread interest in materials science due to their high strength compared to coarse-grained counterparts. It is well know that during uniaxial deformation, the stress-strain behaviour exhibits an extraordinary ...
Earthquakes are the result of slip along faults and are due to the decrease of rock frictional strength (dynamic weakening) with increasing slip and slip rate. Friction experiments simulating the abrupt accelerations (>>10 m/s(2)), slip rates (similar to 1 ...
Post-earthquake residual deformations often control decisions regarding potential demolition of earthquake-damaged buildings. While residual deformations are typically assumed to be lateral, the column residual axial shortening has similar implications for ...
Molecular dynamics simulations were performed to study the deformation mechanisms of < 110 >-oriented, faceted Cu and Au nanowires under bending along three different crystallographic directions. Independent of the bending direction, the stress field is ch ...
Integrated circuit packaging technology has become a prime design consideration for the develop-ment of electronic system concepts. One key issue is the bonding layer between chip and substrate. Currently, high-lead solder materials are being used, which a ...
Hexagonal close-packed (hcp) metals such as Mg, Ti, and Zr are lightweight and/or durable metals with critical structural applications in the automotive (Mg), aerospace (Ti), and nuclear (Zr) industries. The hcp structure, however, brings significant compl ...
The plastic deformation in hcp metals is complex, with the associated dislocation core structures and properties not well understood on many slip planes in most hcp metals. A first step in establishing the dislocation properties is to examine the stable st ...
