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We have designed a wafer level chip scale package for a bi-stable SOI-MEMS dc switch using a silicon-glass hermetic seal with through the lid feedthroughs. Bonded at 365 °C, 230 V and 250 kg, they pass the fine/gross leak test after thermal cycling and mec ...
In the design of new machines or in the development of new concepts, mankind has often observed nature, looking for useful ideas and sources of inspiration. The design of electronic circuits is no exception, and a considerable number of realizations have d ...
In recent years, the semiconductor industry has turned its focus towards heterogeneous multiprocessor platforms. They are an economically viable solution for coping with the growing setup and manufacturing cost of silicon systems. Furthermore, their inhere ...
This paper presents the experimental characterization of two-terminal microfabricated capacitors for microarrays with an electrical sensing of label-free deoxyribonucleic acid (DNA). So far, such a concept has been demonstrated only in experimental setups ...
For the last thirty years, electronics, at first built with discrete components, and then as Integrated Circuits (IC), have brought diverse and lasting improvements to our quality of life. Examples might include digital calculators, automotive and airplane ...
A new top-down design flow (RTL-to-GDSII) is proposed for achieving high-performance and noiseimmune designs consisting of differential logic blocks. The differential building blocks are based on the currentmode logic (CML), which offers true differentiali ...
Current Systems-On-Chip (SoC) execute applications that demand extensive parallel processing. Networks-On-Chip (NoC) provide a structured way of realizing interconnections on silicon, and obviate the limitations of bus-based solution. NoCs can have regular ...
This paper presents fabrication and RF characterization results of spiral inductors fabricated using a developed damascene-like thick-copper / polyimide process module. This module has low thermal budget and is compatible with current IC interconnect archi ...
Formal verification of microprocessors requires a mechanism for efficient representation and manipulation of both arithmetic and random Boolean functions. Recently, a new canonical and graph-based representation called TED has been introduced for verificat ...
Reconfigurable Systems-an-Chip (RSoCs) on the market consist of full -fledged processors and large Field -Programmable Gate Arrays (FPGAs). The latter can be used to implement the system glue logic, various peripherals, and application - specific coprocess ...
