Low Temperature Hermetic Wafer Bonding and Microfabrication of Wall-Coated Alkali Vapor Cells for Chip-Scale Atomic Clocks
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Institute of Electrical and Electronics Engineers2014
A low-temperature sealing technique for micro-fabricated alkali vapor cells for chip-scale atomic clock applications is developed and evaluated. A thin-film indium bonding technique was used for sealing the cells at temperatures of
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