BiVO4 thin film photoanodes grown by chemical vapor deposition

BiVO4 thin film photoanodes were grown by vapor transport chemical deposition on FTO/glass substrates. By controlling the flow rate, the temperatures of the Bi and V sources (Bi metal and V2O5 powder, respectively), and the temperature of the deposition zone in a two-zone furnace, single-phase monoclinic BiVO4 thin films can be obtained. The CVD-grown films produce global AM1.5 photocurrent densities up to 1 mA cm(-2) in aqueous conditions in the presence of a sacrificial reagent. Front illuminated photocatalytic performance can be improved by inserting either a SnO2 hole blocking layer and/or a thin, extrinsically Mo doped BiVO4 layer between the FTO and the CVD-grown layer. The incident photon to current efficiency (IPCE), measured under front illumination, for BiVO4 grown directly on FTO/glass is about 10% for wavelengths below 450 nm at a bias of + 0.6 V vs. Ag/AgCl. For BiVO4 grown on a 40 nm SnO2/20 nm Mo-doped BiVO4 back contact, the IPCE is increased to over 40% at wavelengths below 420 nm.

On the Powder Formation in the Plasma Enhanced Chemical Vapor Deposition Process for the Deposition of SiOx Barrier Coatings

Marina Ricci

Nowadays thin films play an important role in everyday life and in industries. Thin film technology has been developed primarily for the growing demand for development of smaller and smaller devices that require advanced materials and new processing techniques suitable for micro and nano technology. One of the methods of producing thin films is by means of plasma technology. This is a technique by which plasma, also known as 'the fourth state of matter', is used to generate ions, electrons and radicals which deposit at a surface where they will form a thin film. The source of these depositing species could be either gaseous, liquid or solid in origin. Most of the time a plasma is generated by means of an electrical discharge. Plasma technologies are used for various applications. One of these is Plasma Enhanced Chemical Vapor Deposition (PECVD). PECVD systems have widespread applications in the electronic sector, because of their exibility in depositing different films such as silicon oxide thin films (SiOx). These films, currently deposited by organosilicon compounds, such as hexamethyldisiloxane (HMDSO), have dielectric and good barrier properties. The aim of the work at CRPP consists in optimizing PECVD processes for the deposition of these films on polymers. In this study, the species in gaseous phase and the powder produced in oxygen-diluted HMDSO plasmas were experimentally characterized in a radiofrequency (RF) capacitively-coupled reactor at 13.56 MHz. The gaseous phase of these plasmas and the particle formation were studied by in-situ infrared absorption spectroscopy and optical emission spectroscopy. The study of the powder formation is important because the particle deposition imposes an upper limit on the deposition rate. Particle formation was firstly studied as a function of HMDSO/O2 ratio. Analysis of the time evolution of the infrared absorption spectra gives the development of the size, the number density, the structure and the particle composition. At high oxygen dilution the formation of large particles is observed. The analysis of HMDSO/O2 plasma at low O2 content suggests that at the beginning of the process very small particles are formed by polymerization; the same particles do not grow much and keep sizes around 50 nm. The admixture of inert or non-reactant gases, such as Ar or N2, into the plasma promotes polymerization of the monomer; a high value of one of these inert or non-reactant gases leads to small powder particle size, since only polymerization takes place in this case. Particle size around 50 nm is also found in this case. At the same time we see a decrease of the carbon content and a weak reduction of the stoichiometry in SiOx indicated by the shift of the SiOSi asymmetric stretching vibration. This reduction also influences the deposited layers, less oxidized and, thus, quite far from a stoichiometric character. Hexamethyldisilazane (HMDSN) and tetramethylsilane (TMS) are other reagents that have been identified as alternatives to HMDSO. The in-situ infrared absorption spectra show that HMDSO/O2 and HMDSN/O2 plasmas are quite similar, but in the second case a lower SiOSi stretching peak intensity, due to NH and SiN peaks, is seen. TMS/O2 and HMDSN/O2 plasma spectra show a low SiOSi bending and stretching peak intensity, due also to the oxygen atom absence in their chemical structure. Two separate chapters are respectively devoted to the silicon nitride thin films (SiNx) and plasma crystal formation. SiNx layers are deposited by three different organosilicon compounds, such as HMDSN, TMS and bis(dimethylamino)dimethylsilane (BDMADMS). No powder formation is visualized in this contest. The ex-situ infrared absorption spectra show the difficulty to produce stable SiNx films; they present a low SiN peak intensity and are quite hygroscopic. Furthermore, in HMDSO/O2 plasmas at high oxygen dilution and high pressure, later in time into the discharge, accretion leads to larger and larger particles which can finish up in particles forming a plasma crystal. The study of RF harmonics shows the presence of instabilities, clear indications of the passage from small particulate to plasma crystal structure.

EPFL2011

Selective Growth of Titanium Dioxide by Low-Temperature Chemical Vapor Deposition

Patrik Hoffmann, Yury Kuzminykh, Michael Oliver Reinke

A key factor in engineering integrated optical devices such as electro-optic switches or waveguides is the patterning of thin films into specific geometries. In particular for functional oxides, etching processes are usually developed to a much lower extent than for silicon or silicon dioxide; therefore, selective area deposition techniques are of high interest for these materials. We report the selective area deposition of titanium dioxide using titanium isopropoxide and water in a high-vacuum chemical vapor deposition (HV-CVD) process at a substrate temperature of 225 °C. Here—contrary to conventional thermal CVD processes—only hydrolysis of the precursor on the surface drives the film growth as the thermal energy is not sufficient to thermally decompose the precursor. Local modification of the substrate surface energy by perfluoroalkylsilanization leads to a reduced surface residence time of the precursors and, consequently, to lower reaction rate and a prolonged incubation period before nucleation occurs, hence, enabling selective area growth. We discuss the dependence of the incubation time and the selectivity of the deposition process on the presence of the perfluoroalkylsilanization layer and on the precursor impinging rates—with selectivity, we refer to the difference of desired material deposition, before nucleation occurs in the undesired regions. The highest measured selectivity reached (99 ± 5) nm, a factor of 3 superior than previously reported in an atomic layer deposition process using the same chemistry. Furthermore, resolution of the obtained patterns will be discussed and illustrated.

Amer Chemical Soc2015

Surface Kinetics of Titanium Isopropoxide in High Vacuum Chemical Vapor Deposition

Patrik Hoffmann, Yury Kuzminykh, Michael Oliver Reinke

Understanding the surface kinetics of precursor decomposition during thin film formation represents a key aspect in the understanding and engineering of chemical vapor deposition (CVD) and atomic layer deposition (ALD) processes. The determination of activation energies of the surface reaction steps, however, is often challenging because it requires precise knowledge of precursor impinging rates. Afterward, the kinetics can be investigated by comparing the amount of deposited material with the absolute precursor flow. Ideally, the experimental equipment allows a distinction between gas phase and surface reactions. Both are difficult to achieve in conventional CVD processes. A high vacuum environment, however, enables the quantitative prediction of precursor impinging rates due to the ballistic nature of precursor transport; additionally precursor gas phase reactions do not occur. We investigated the surface reaction kinetics of titanium isopropoxide (TTIP) in the high vacuum CVD of titanium dioxide. Additionally, we have investigated the addition of water as a reactani to the deposition process. In this way, even surface kinetics relevant for ALD processes could be investigated. Here, we propose a comprehensive surface kinetic model of titanium isopropoxide surface reactions including hydrolytic and pyrolytic reactions. The surface kinetic model was fitted to 363 data points taken from combinatorial experiments covering a wide range of deposition parameters (substrate temperature, 175-610 degrees C; TTIP impinging rate, 0.1 x 10(15)-6.0 x 10(15)cm(-2) s(-1); water impinging rate, 4.5 x 10(16)cm(-2) s(-1)), which enabled us to derive activation energies for desorption, hydrolysis, and pyrolysis.

American Chemical Society2015

On the Powder Formation in the Plasma Enhanced Chemical Vapor Deposition Process for the Deposition of SiOx Barrier Coatings

Marina Ricci

EPFL2011