Plastic deformation mechanisms in nanocrystalline columnar grain structures
Graph Chatbot
Chattez avec Graph Search
Posez n’importe quelle question sur les cours, conférences, exercices, recherches, actualités, etc. de l’EPFL ou essayez les exemples de questions ci-dessous.
AVERTISSEMENT : Le chatbot Graph n'est pas programmé pour fournir des réponses explicites ou catégoriques à vos questions. Il transforme plutôt vos questions en demandes API qui sont distribuées aux différents services informatiques officiellement administrés par l'EPFL. Son but est uniquement de collecter et de recommander des références pertinentes à des contenus que vous pouvez explorer pour vous aider à répondre à vos questions.
The studies presented in this thesis aim to extend the current knowledge and understanding of the mechanical behavior of nanocrystalline materials with respect to temperature- and time dependence. Free standing electrodeposited nanocrystalline nickel speci ...
A method for manufacturing an object including the steps of forming layers by adding successive layers of material to form the object by selective laser melting (SLM), and inducing plastic deformation and residual stress into solidified material of at leas ...
The tensile elongation of an < 011 > oriented columnar nanocrystalline pure iron structure at a temperature of 300 K has been simulated by molecular dynamics (MD). The simulated sample contains 4.3 x 10(6) atoms and has been subject to free elongation alon ...
Nanocrystalline (NC) metals have attracted widespread interest in materials science due to their high strength compared to coarse-grained counterparts. It is well know that during uniaxial deformation, the stress-strain behaviour exhibits an extraordinary ...
This work reports on the microstructure and mechanical properties of porous silver films produced with different sintering parameters. The microstructure is investigated by high-resolution ptychographic Xray computed tomography and scanning electron micros ...
Integrated circuit packaging technology has become a prime design consideration for the develop-ment of electronic system concepts. One key issue is the bonding layer between chip and substrate. Currently, high-lead solder materials are being used, which a ...
In this article, the hot deformation mechanism of a laser-welded near a TA15 Ti-alloy joint was studied by hot tensile tests conducted at temperatures ranging from 800 degrees C to 900 degrees C with strain rates ranging from 1.0 x 10(-1) s(-1) to 1.0 x 10 ...
Atomistic simulations of bicrystal samples containing a grain boundary are used to examine the effect of hydrogen atoms on the nucleation of intergranular cracks in Ni. Specifically, the theoretical strength is obtained by rigid separation of the two cryst ...
A two-dimensional analytical stress distribution model taking into account the effects of large deformation, bending-tension coupling and interfacial compliance on the quasi-static behavior of unbalanced FRP composite single-lap joints (SLJs) under tension ...
This paper expands on the impact of the thermally induced deformation of the soil on the serviceability mechanical performance (i.e., deformation-related) of energy pile groups. The work is based on the results of a full-scale in-situ test that was perform ...
