Dissipateur thermique constitue d'un materiau composite diamant-cuivre renfermant du bore
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The present invention relates to a redox copper complex melt comprising a metalorganic complex of formula (I) [Cu (La) n ] (I), wherein n is an integer 2; and La is a bidentate ligand selected from a ligand according to any one of formulae (1) and (2): ...
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Plate heat exchangers are adopted in many domestic and industrial applications, such as ventilation, air conditioning, evaporation or condensation process, heat pumps and cooling of hydrodynamic circuits in engines. In the present thesis, an extensive expe ...
In situ investigations of rapid solidification in polycrystalline Al thin films were conducted using nano-scale spatio-temporal resolution dynamic transmission electron microscopy. Differences in crystal growth rates and asymmetries in melt pool developmen ...
The influence of the thickness of a thin (1.5-30 nm) copper layer on the thermal boundary conductance (TBC) at the interface between gold and silicon, sapphire and diamond, respectively, was studied using Time Domain Thermoreflectance. Overall, a monotonic ...
This thesis investigates a set of advanced topics inspired from the heat integration and the pinch technology, all tied around the challenge of identifying energy savings in large-scale chemical industrial plants. In search for a general-purpose methodolog ...
The effect of an Al2O3 interlayer on the thermal conductance of metal (Al)/non-metal (diamond and silicon) interfaces is investigated using Time Domain ThermoReflectance (TDTR). Interlayers between 1.7 and 20nm are deposited on oxygen-terminated diamond an ...
The monitoring of heat flux is becoming more and more critical for many technologies approaching nanometric dimensions. Scanning Thermal Microscopy (SThM) is one of the tools available for thermal measurement at the nanoscale. This measurement technics nee ...
The thermal boundary conductance (TBC) between thin films of Cr, Mo, Nb and W and diamond substrates has been measured using time domain thermoreflectance before and after a high-vacuum heat treatment at 800 degrees C for 2 h. While no signs of carbide for ...
High temperature heat pumps (HTHPs) with heat sink temperatures in the range of 100 to 160°C are expected to become increasingly commercialized in the coming years. Major applications have been identified, particularly in the food, paper, metal and chemica ...