Development of interconnected silicon micro-evaporators for the on-detector electronics cooling of the future ITS detector in the ALICE experiment at LHC
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Three-dimensional (3D) stacking is an attractive method for designing large manycore chips as it provides high transistor integration densities, improves manufacturing yield due to smaller chip area, reduces wirelength and capacitance, and enables heteroge ...
Institute of Electrical and Electronics Engineers2011
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertical integration of layers exacerbates the reliability and thermal problems, a ...
3D stacked architectures reduce communication delay in multiprocessor system-on-chips (MPSoCs) and allowing more functionality per unit area. However, vertical integration of layers exacerbates the reliability and thermal problems, and cooling is a limitin ...
Fragmented solid targets made of either fluidised tungsten powder or static pebble bed of tungsten spheres, have been long proposed and are being studied as an alternative configuration towards high-power (>1 MW of beam power) target systems, suitable for ...
