Morphology and interfacial strength of nonisothermally fusion bonded hard and soft thermoplastics
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Hydrogen bonding in ionic liquids based on the 1-(2'-hydroxylethyl)-3-methylimidazolium cation (C(2)OHmim) and various anions (A) of differing H-bond acceptor strength, viz. hexafluorophosphate PF6, tetrafluoroborate BF4, bis-(trifluoro ...
Heck shortens the distance. Palladium-catalyzed activation of C(sp3)-H bond by a σ-alkyl Pd(II) complex generated in situ from a remote arylhalide function is developed. The novel domino carbopalladation/C(sp3)-C(sp3) bond forming process allowed a rapid a ...
One central aim of nanotechnology is the creation and exploitation of nanostructured materials with pre-programmed architecture and properties. The fabrication of functional nanostructures relies on versatile protocols of synthetic chemistry enabling the p ...
EPFL2012
Hermiticity is an essential requirement of a MEMS package for a device to work properly. Hermeticity also must be preserved during the operations following packaging, during which the package bond should not remelt. Bonding temperature is limited however t ...
This paper investigates the effects of temperature, thermal cycling and humidity on the structural response of SG-laminated reinforced glass beams (SG = SentryGlas®). To do so, a series of pull-out test (to investigate the bond strength of the SG interlaye ...
We present a low-temperature indium hermetic bonding technique on wafer level without using flux, active atmosphere or other pretreatment of the indium. Its simplicity and low temperatures allow encapsulation of sensitive MEMS devices. Bonding stronger tha ...
IEEE2012
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needed. By an optimized patterning of the evaporated indium film and the lid, surface hermetic bonding on wafer level is reached without exceeding 140 °C in any step of the procedure. Different designs of the indium metallization and lid were tested to imp ...
Elsevier Science, Reg Sales Off, Customer Support Dept, 655 Ave Of The Americas, New York, Ny 10010 Usa2011
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Dimethylaminonitrene complexes of IMesM+ (IMes = 1,3-bis(2,4,6-trimethylphenyl)- imidazol-2-ylidene; M = Cu, Ag, Au) were prepared in the gas phase and structurally characterized by high-resolution infrared spectroscopy of the cold species, ion-molecule re ...
We introduce a new low temperature (280 °C) parylene-C wafer bonding technique, where parylene-C bonds directly a Pyrex wafer to a silicon wafer with either a Si, SiO2 or Si3N4 surface with a bonding strength up to 23 MPa. The technique uses a single layer ...
Using density functional calculations, we studied substoichiometric Ge oxides through a series of crystalline models representing the various oxidation states. We evaluated deviations with respect to a bond-energy description in terms of penalty energies f ...