Influence of the thickness of a nanometric copper interlayer on Au/dielectric thermal boundary conductance
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The aim of this project is to understand the correlation between alloy composition and the build-up of internal stresses in 18 carat Au-Ag-Cu alloys under thermo-mechanical loads. The copper rich end of this ternary system exhibits order-hardening of the e ...
In high energy physics, semiconductor-based sensors are widely used in particle tracking applications. These sensors are typically glued on low-mass cooling substrates, which guarantee the correct thermal management and, at the same time, minimise their in ...
In many semiconductor technologies, including GaN, the lack of p-channel devices is a major obstacle for complementary operations. Here, we demonstrate high-performance polycrystalline diamond p-channel transistors on GaN-on-Si. Following the optimization ...
The Thermal Boundary Conductance (TBC) at the interface between metals and dielectrics is of key importance for heat transport in structures heterogeneous on a scale from 100 µm downwards. In this thesis the TBC of a large number of metal/dielectric couple ...
EPFL2019
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The project ASHRAE 1759-RP addresses the impact of the ventilated cavity behind external claddings on the thermal performance of the wall structure by defining “effective thermal resistance” of air gaps based on the linearized network of thermal resistance ...
ASHRAE2020
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Thermal boundary conductance (TBC) of the Ag/diamond and Au/diamond interfaces with a nanometer-thick interface layer of either nickel or molybdenum is measured by time domain thermoreflectance and modeled based on a 3-layer two-temperature model (3l-TTM). ...