Effect of surface modification of colloidal silica nanoparticles on the rigid amorphous fraction and mechanical properties of amorphous polyurethane-urea-silica nanocomposites
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As part of a broader effort to establish processing-structure-property relationships in PLLA/nHA, which is currently under consideration for bioresorbable scaffolds for bone repair, hot stage optical microscopy and differential scanning calorimetry have be ...
As part of a broader effort to establish processing-structure-property relationships in PLLA/nHA, which is currently under consideration for bioresorbable scaffolds for bone repair, hot stage optical microscopy and differential scanning calorimetry have be ...
Temperature dependence of physical and mechanical properties is considered in most thermal and mechanical response models for composite materials. Based on thermogravimetry analysis, differential scanning calorimetry, and dynamic mechanical analysis conduc ...
The solubility of alkylthiol-coated silver nanoparticles and the energetics of the ligand disordering have been investigated. Calorimetry measurements have provided correlations between the nature of the ligands and the enthalpy of the ligand disordering, ...
This paper is an experimental and numerical investigation of desiccation and the associated cracking. First an elastic formulation of the hydro-mechanical problem is presented, based on an analogy that can be drawn with thermo-elasticity. Then, the results ...
The scope of this paper is to present the global mechanisms of soil desiccation, including drying shrinkage and cracking. The paper first reviews the basic processes that are beneath the word “desiccation”. Then the results of an experimental study of desi ...
A waterborne latex-based technique has been used to prepare acrylic films with laponite contents up to about 25 vol%. The laponite was attached to the surfaces of the latex particles, giving a cellular arrangement of laponite-rich regions at high laponite ...
Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...
A model for predicting composite material strength degradation under elevated and high temperatures is proposed. This model is based on the morphology of the mixture of materials in different states. The degradation of resin-dominated shear strength can be ...
Diamond reinforced metals with a diamond content of 55-60 vol.% were made by gas driven liquid metal infiltration. They were characterized with regard to their stiffness, strength and fracture toughness as a function of diamond particle size and matrix all ...