Reliability analysis of lead-free solders for an aerospace application
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The introduction of new packages as well as the ongoing miniaturization in SMT make the evaluation of the reliability of solder joints a permanent task. Passive thermal cycling is an important test to evaluate the lifetime of solder joints. However, tin-le ...
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There is some confusion in the literature about the material parameters for eutectic tin-lead solder. This is mainly caused by the varying parameters under which the samples are processed and treated prior to testing, which lead to different microstructure ...
In this paper, the stability of a displacement sensor assembled with Sn96 (tin- silver) solder, Sn62 (tin-leadsilver) solder or conductive silver-loaded epoxy glue was compared. In the absence of humidity or thermal cycling, the glue was found to be much b ...
The phase equilibria of the ternary Al-AlCo-AlNi system were investigated around the decagonal phase. Isopleths with 70, 71.5 and 72.5 at.% Al and with 10 and 13 at.% Ni are elaborated with the aid of differential thermoanalysis, magnetothermal analysis, o ...
The occurrence of new packages as well as the ongoing miniaturization in SMT make the evaluation of the reliability of solder joints an permanent task. Accelerated testing, especially passive thermal cycling, is a important tool to evaluate the lifetime of ...
