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We report the fabrication of solenoidal microcoils with hollow core embedded within two 100 µm thick borosilicate glass wafers. The main process steps are the reactive ion etching of borosilicate glass, anodic wafer bonding, copper metal organic chemical v ...
An etching technology for the patterning of suspended GaN structures on lattice matched AlInN sacrificial layers is studied. Selective dry RIE etching of GaN to AlInN is demonstrated, which allows effective pattern transfer without affecting lower layers. ...
We report on the fabrication of atomic force microscopy (AFM) probes using a novel technology that performs every machining step by means of one single deep reactive ion etching (DRIE) equipment. Specific etching conditions are optimized in order to define ...
In this paper, a new and simple silicon straight tube is tested as a fluid density sensor. The tube structure has a hexagonal cross section. The fabrication process consists of anisotropic silicon etching and silicon fusion bonding. A tube structure with a ...
We report on the fabrication of atomic force microscopy (AFM) probes using a novel technology that performs every machining step by means of one single deep reactive ion etching (DRIE) equipment. Specific etching conditions are optimized in order to define ...
During this project, ultrasensitive cantilevers designed for nuclear magnetic resonance applications were fabricated and characterised. The cantilevers are 500, 340 or 200 μm long, 10 or 20 μm wide and 500 or 340 nm thick and integrate a thin film of cobal ...
We present all-optical tuning and switching of a microcavity inside a two-dimensional photonic crystal waveguide. The photonic crystal structure is fabricated in silicon-on-insulator using complementary metal-oxide semiconductor processing techniques based ...
We have developed a hybrid scanning probe microscopy sensor consisting of a SU-8 body and full platinum cantilever and tip. The fabrication process is based on surface-micromachining of a silicon wafer, where oxidation sharpened moulds define the tip shape ...
The work presented in this paper deals with the bonding of small structures, down to 1 mu m. Its aim is to evaluate the dimensional limits of anodic bonding between silicon and pyrex 7740 glass. Test structures consisting in silicon pillars with controlled ...
In this paper, we present the design, simulation, fabrication, and some measurement and characterization of a novel 16-bit digital variable optical attenuator (VOA) that attenuates by switching individual mirror of an array as an attempt to achieve input v ...