Reliability analysis of lead-free solders for an aerospace application
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The phase equilibria of the ternary Al-AlCo-AlNi system were investigated around the decagonal phase. Isopleths with 70, 71.5 and 72.5 at.% Al and with 10 and 13 at.% Ni are elaborated with the aid of differential thermoanalysis, magnetothermal analysis, o ...
Scanning near-field optical microscopy (SNOM) is an optical microscopy whose resolution is not bound to the diffraction limit. It provides chemical information based upon spectral, polarization and/or fluorescence contrast images. Details as small as 20 nm ...
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In this paper, the stability of a displacement sensor assembled with Sn96 (tin- silver) solder, Sn62 (tin-leadsilver) solder or conductive silver-loaded epoxy glue was compared. In the absence of humidity or thermal cycling, the glue was found to be much b ...
We present three-dimensional simulations of the image formation process in near-field optical microscopy, Our calculations take into account the different components of a realistic experiment: an extended metal coated tip, a subwavelength sample and its su ...
The main purpose of this thesis is to explore a new concept of SNOM probes. In order to produce more reliable and reproducible tips, we propose to graft a single gold particle of 60 nm diameter onto the aperture of a SNOM probe. The expected advantage of s ...
There is some confusion in the literature about the material parameters for eutectic tin-lead solder. This is mainly caused by the varying parameters under which the samples are processed and treated prior to testing, which lead to different microstructure ...
Abstract: Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to s ...
The occurrence of new packages as well as the ongoing miniaturization in SMT make the evaluation of the reliability of solder joints an permanent task. Accelerated testing, especially passive thermal cycling, is a important tool to evaluate the lifetime of ...
The introduction of new packages as well as the ongoing miniaturization in SMT make the evaluation of the reliability of solder joints a permanent task. Passive thermal cycling is an important test to evaluate the lifetime of solder joints. However, tin-le ...
