REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal
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The invention of the integrated circuit and the manufacturing progress as well as continuing progress in the manufacturing process are the fundamental engines for the implementation of all technologies that support today's information society. The vast maj ...
Reliable operation in harsh environments such as high temperatures, high pressures, aggressive media and space, poses special requirements for sensors and packages, which usually cannot be met using polymer-based technologies. Ceramic technologies, especia ...
Design techniques for three-dimensional (3-D) ICs considerably lag the significant strides achieved in 3-D manufacturing technologies. Advanced design methodologies for 2-D circuits are not sufficient to manage the added complexity caused by the third dime ...
Springer-Verlag New York, Ms Ingrid Cunningham, 175 Fifth Ave, New York, Ny 10010 Usa2010
A generic method for the reverse processing of dry photoresist is proposed. The technique is based on the lamination of pre-patterned polymeric structures on the pre-existing devices. The concept is illustrated with the encapsulation at the foil level of g ...
Elsevier Science, Reg Sales Off, Customer Support Dept, 655 Ave Of The Americas, New York, Ny 10010 Usa2010
We present a general metallization process for the fabrication of solenoidal micro-coils for high resolution MRI of volume-limited samples. The process allows for the MEMS-compatible batch fabrication of identical coils. Hollow conductors are integrated wi ...
A generic method for the packaging of transducers at the foil level is proposed and was demonstrated on chemical gas sensors made on a plastic foil. The processing was based on the lamination of pre-patterned polymeric structures on the fabricated devices ...
Emerging pervasive wireless networks, pocket switched networks, Internet of things, vehicular networks and even sensor networks present very challenging communication circumstances. They might involve up to several hundreds of wireless devices with mobilit ...
Computing realistic routes for a given road network and a known demand of vehicles is one of the most important steps when preparing a road traffic simulation. The approach developed by Christian Gawron in 1998 which we use for this purpose computes a dyna ...
LTCC and thick-film technologies constitute excellent platforms for hermetic and controlled-atmosphere packaging, for applications in MEMS, space, micro/nanofabrication and biological fields. This work presents an active oxygen getter module, based on an i ...
Hybrid integration and especially the packaging of microelectromechanical systems (i.e. MEMS) cannot rely on standardised packaging solutions due to the diversity of microsystems. As an example, the packaging requirements of a pressure sensor are different ...
Institut de Microtechnique, Université de Neuchâtel2009