Publication
3D Printing of Customizable Transient Bioelectronics and Sensors
Publications associées (35)
A 3.1 mW 8b 1.2 GS/s Single-Channel Asynchronous SAR ADC With Alternate Comparators for Enhanced Speed in 32 nm Digital SOI CMOS
Yusuf Leblebici, Lukas Kull, Thomas Toifl
An 8b 1.2 GS/s single-channel Successive Approximation Register (SAR) ADC is implemented in 32 nm CMOS, achieving 39.3 dB SNDR and a Figure-of-Merit (FoM) of 34 fJ per conversion step. High-speed operation is achieved by converting each sample with two alt ...
Institute of Electrical and Electronics Engineers2013Polymeric hemispherical pico-liter micro cups fabricated by inkjet printing
Jürgen Brugger, Massimo Mastrangeli, Victor Javier Cadarso Busto, Rosario Maurizio Gullo, Loïc Jacot-Descombes
The fabrication of precise hemispherical shape is challenging with standard planar lithography techniques. A suitable alternative is the fabrication by inkjet printing. This paper presents a method based on drop-on-demand inkjet printing on pre-patterned s ...
IEEE2013Inkjet Printing of Interdigitated Capacitive Chemical Sensors with Reduced Size by the Introduction of a Dielectric Interlayer
Nico de Rooij, Danick Briand, Francisco Molina Lopez
A new fabrication strategy is proposed to reduce the size of sensors based on inkjet-printed interdigitated electrodes (IDE). The process is compatible with fabrication at low temperature and can be applied to flexible organic foils. The new fabrication co ...
Elsevier Science Bv2012Inkjet Printing of Interdigitated Capacitive Chemical Sensors with Reduced Size by the Introduction of a Dielectric Interlayer
Nico de Rooij, Danick Briand, Francisco Molina Lopez
A new fabrication strategy is proposed to reduce the size of sensors based on inkjet-printed interdigitated electrodes (IDE). The process is compatible with fabrication at low temperature and can be applied to flexible organic foils. The new fabrication co ...
Elsevier Science Bv2012Inkjet Printing of Silver on Flexible Substrates for Sensing Applications
Nico de Rooij, Danick Briand, Jérôme Courbat, Francisco Molina Lopez
We report on the fabrication of a low cost sensing platform which includes printed / electroplated resistive thermometers and capacitive-based humidity sensors working at ultra low power consumption. Both types of devices were integrated on the same polyme ...
2011Lead-free high-temperature dielectrics with wide operational range
The dielectric, electrical and structural properties of (1-x) (0.94Bi(1/2)Na(1/2)TiO(3)-0.06BaTiO(3))-xK(0.5)Na(0.5)NbO(3) (BNT-BT-xKNN) with x=0.09, 0.12, 0.15, and 0.18 were investigated as potential candidates for high-temperature capacitors with a work ...
American Institute of Physics20113D Patterning of Hydrogels and Cells by Multi-Component Inkjet Printing
Jürgen Brugger, Matthias Lütolf, Kristopher Pataky, Andrea Negro
Recapitulating the spatial and temporal complexity of tissues or organs represents one of the biggest challenges in engineering tissue-like living constructs in vitro. Inkjet printing with its high positioning precision (±1μm) and reliable droplet generati ...
2011Fabrication of polymeric micro structures by controlled drop on demand inkjet printing
Jürgen Brugger, Victor Javier Cadarso Busto, Rosario Maurizio Gullo, Loïc Jacot-Descombes
Well controlled spherical microstructures could enable several novel MEMS devices. However, micro machining of spherical shapes has proven to be difficult with conventional planar microfabrication processes [1]. This paper presents a method allowing to fab ...
Department of micro and nano systems technology Vestfold University College, Norway2011Gas Sensors on Plastic Foil with Reduced Power Consumption for Wireless Applications
Recently, there is a growing interest in developing so-called "smart" RFID tags for logistic applications. These smart tags incorporate sensing devices to monitor environmental parameters such as humidity and temperature throughout the supply chain. To ful ...
EPFL2010Power Distribution Paths for 3-D IC
Giovanni De Micheli, Vasileios Pavlidis
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (TSVs) in most of the manufacturing techniques for three-dimensional (3-D) cir ...
ACM Order Department, P.O. Box 64145, Baltimore, MD 21264 USA2009