A new interconnect-centric design methodology for high-speed standard cells with crosstalk immunity

One of the biggest challenges that are facing the Very Large Scale Integrated Circuits (VLSI) technologies today is the significant performance gap (3× to 9×) between full custom circuits and Application Specific Integrated Circuits (ASICs) designed in the same process generation. This situation is mainly exacurbated by the lack of suitable design tools and methodologies that can properly take into account the real implications and limitations of very deep submicron (VDSM) and nanometer scale technologies. The limitations are largely related to the signal integrity problems, caused by shrinking feature sizes with each new process. Crosstalk, for example, is one of the major issues because it results in unpredictable circuit behavior. This may cause significant timing variations, if not functional failures. Similarly, device and interconnect parasitics become harder to calculate, especially with irregular layout geometries. Accurate and early prediction of such problems, on the other hand, is virtually not possible with the existing tools. Meanwhile, the custom circuits become less affordable because of the skyrocketing design and manufacturing costs. At this point, the gate-array-like structures are becoming an increasingly popular alternative for rapid, low-cost realization of Integrated Circuits (ICs), filling the gap between Field-Programmable Gate-Arrays (FPGAs) and full-custom ASICs. In this work, the main goal is to provide an interconnect-centric design methodology, for which the underlying thinking is prevention over treatment of all these issues. Therefore, a "recipe" is described on how to early characterize these problems and address them even before they appear later during the implementation process. A simple generic RLCK interconnect model is developed and used to systematically characterize the interconnects of various geometries for delay, power and crosstalk noise. The superior performance of the differential interconnects in comparison to mainstream single-ended lines has lead to addressing the insufficient support of the Electronic Design Automation (EDA) tools for differential signaling. A complete RTL-to-GDSII differential design flow is developed that utilizes the advanced design tools through netlist conversion scripts. The advantages of differential signaling are merged with gate-level regularity in a mask-programmable cell fabric suitable for structured ASIC applications, where the basic building block is a via-programmable universal logic gate in MOS current-mode logic (MCML). The MCML design style offers good speed performance and addresses the noise immunity and crosstalk problems thanks to its differential operation. The unit cell can realize all functions up to 3-input and some of the 4-input and 5-input functions. The implementation of benchmark circuits with the proposed fabric have shown that the associated cost is acceptable when compared to the alternatives (standard-cell ASIC and FPGA). Finally, a novel design methodology is proposed which is based on correct-by-construction approach and is claimed to be a better candidate for future designs in nanometer technologies. The methodology is flexible in the sense that it makes it easier to model and to integrate emerging problems through its simulation based design exploration approach, which, in the scope of this thesis, has been focused on interconnect-related issues only. With case studies it is shown that the number of design flow iterations can be dramatically reduced or even removed by better guiding the physical implementation tools. The results dictate the EDA tools a number of advanced features to offer and/or the designers to more strongly utilize some of the existing tool capabilities, in order to manage the ever increasing design complexity.

SOI mixed-mode design techniques and case studies

Marija Blagojevic

Since the emergence of Silicon On Insulator (SOI) technology the research activities have been concentrated on a detailed analysis of SOI devices and their use in different application fields (low-voltage, low-power circuits, high temperature electronics, digital circuits, etc.). The present thesis deals with low-voltage, low-power mixed-mode design using a SOI technology. The goal is to establish the concepts that allow one to design SOI mixed-mode circuits, and to apply these concepts to the design of fully depleted (FD) and partially depleted (PD) SOI circuits and systems. Two studies have been realized in the scope of this work: a Hall sensor based microsystem design using an experimental FD SOI technology a DRAM design using capacitor-less 1T floating-body PD SOI memory cells. At the beginning of this thesis, two major types of SOI devices are introduced, namely FD and PD devices. The most important properties of these devices are then presented and compared to those of CMOS bulk devices. A design methodology based on design retargeting from bulk to SOI technology is further proposed. This methodology is developed with the aim of being implemented for the design of FD SOI circuits. It consists in using the same device dimensions and bias currents for the bulk and the corresponding FD SOI design. The analysis performed proves that such an approach permits one to obtain better circuit performances using the FD SOI technology. The EKV model is chosen for Spice simulations. For that purpose the extraction of the EKV intrinsic parameters has been performed for the experimental 0.5 μm FD SOI technology. The EKV model card obtained from transistor measurements is implemented straightforwardly for circuit simulations. The first study presented in this thesis is an FD SOI Hall sensor front-end for energy measurement. The mixed-mode microsystem design is completely based on the proposed design methodology. The system level solutions are also included, such as the spinning-current method that serves for reduction of the offset and low frequency noise of the analog front-end, and a high resolution analog-to-digital conversion technique. The integrated microsystem is entirely functional. Furthermore, according to the existing literature, this integrated circuit is the first microsystem completely realized using FD SOI technology. The overall system error that is obtained is less than 1.5 %. During the second part of this work, a novel sensing scheme that exploits an automatic reference generation based on successive approximations has been developed for the PD SOI capacitor-less 1T DRAM. The 1T DRAM reference current is generated by an adjustable current source. The electrical calibration of the reference current is performed using a digital-to-analog converter and successive approximations algorithm. The proposed scheme is evaluated in a 2 kb test chip. The circuit integrated using PD SOI technology contains a 2 kb 1T memory array, as well as automatic reference generators and peripheral circuits. The automatic reference generator comprises current mode sense amplifier, M/3M converter, and successive approximations register. All blocks implemented in the test chip are described in detail, and PD SOI design issues are discussed. A number of experimental results demonstrate the potential of the PD SOI 1T DRAM for future embedded DRAM applications. The measured retention time under holding conditions is higher than 1s. In the continuous read mode, a few hundreds of the read cycles can be performed without a refresh operation. The test chip has a measured access time of 25 ns with a read cycle time of 70 ns.

EPFL2005

Closing the Gap between FPGA and ASIC

Hadi Parandeh Afshar

Despite many advantages of Field-Programmable Gate Arrays (FPGAs), they fail to take over the IC design market from Application-Specific Integrated Circuits (ASICs) for high-volume and even medium-volume applications, as FPGAs come with significant cost in area, delay, and power consumption. There are two main reasons that FPGAs have huge efficiency gap with ASICs: (1) FPGAs are extremely flexible as they have fully programmable soft-logic blocks and routing networks, and (2) FPGAs have hard-logic blocks that are only usable by a subset of applications. In other words, current FPGAs have a heterogeneous structure comprised of the flexible soft-logic and the efficient hard-logic blocks that suffer from inefficiency and inflexibility, respectively. The inefficiency of the soft-logic is a challenge for any application that is mapped to FPGAs, and lack of flexibility in the hard-logic results in a waste of resources when an application cannot use the hard-logic. In this thesis, we approach the inefficiency problem of FPGAs by bridging the efficiency/flexibility gap of the hard- and soft-logic. The main goal of this thesis is to compromise on efficiency of the hard-logic for flexibility, on the one hand, and to compromise on flexibility of the soft-logic for efficiency, on the other hand. In other words, this thesis deals with two issues: (1) adding more generality to the hard-logic of FPGAs, and (2) improving the soft-logic by adapting it to the generic requirements of applications. In the first part of the thesis, we introduce new techniques that expand the functionality of FPGAs hard-logic. The hard-logic includes the dedicated resources that are tightly coupled with the soft-logic –i.e., adder circuitry and carry chains –as well as the stand-alone ones –i.e., DSP blocks. These specialized resources are intended to accelerate critical arithmetic operations that appear in the pre-synthesis representation of applications; we introduce mapping and architectural solutions, which enable both types of the hard-logic to support additional arithmetic operations. We first present a mapping technique that extends the application of FPGAs carry chains for carry-save arithmetic, and then to increase the generality of the hard-logic, we introduce novel architectures; using these architectures, more applications can take advantage of FPGAs hard-logic. In the second part of the thesis, we improve the efficiency of FPGAs soft-logic by exploiting the circuit patterns that emerge after logic synthesis, i.e., connection and logic patterns. Using these patterns, we design new soft-logic blocks that have less flexibility, but more efficiency than current ones. In this part, we first introduce logic chains, fixed connections that are integrated between the soft-logic blocks of FPGAs and are well-suited for long chains of logic that appear post-synthesis. Logic chains provide fast and low cost connectivity, increase the bandwidth of the logic blocks without changing their interface with the routing network, and improve the logic density of soft-logic blocks. In addition to logic chains and as a complementary contribution, we present a non-LUT soft-logic block that comprises simple and pre-connected cells. The structure of this logic block is inspired from the logic patterns that appear post-synthesis. This block has a complexity that is only linear in the number of inputs, it sports the potential for multiple independent outputs, and the delay is only logarithmic in the number of inputs. Although this new block is less flexible than a LUT, we show (1) that effective mapping algorithms exist, (2) that, due to their simplicity, poor utilization is less of an issue than with LUTs, and (3) that a few LUTs can still be used in extreme unfortunate cases. In summary, to bridge the gap between FPGAs and ASICs, we approach the problem from two complementary directions, which balance flexibility and efficiency of the logic blocks of FPGAs. However, we were able to explore a few design points in this thesis, and future work could focus on further exploration of the design space.

EPFL2012

Signaling in 3-D integrated circuits, benefits and challenges

Somayyeh Rahimian Omam

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuits provide a potent approach to enhance the performance and integrate diverse functions within amulti-plane stack. Clock networks consume a great portion of the power dissipated in a circuit. Therefore, designing a low-power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Synchronization issues can be more challenging for 3-D circuits since a clock path can spread across several planes with different physical and electrical characteristics. Consequently, designing low power clock networks for 3-D circuits is an important issue. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. In this research, a design method to apply resonant clocking to synthesized clock trees is proposed. Manufacturing processes for 3-D circuits include some additional steps as compared to standard CMOS processes which makes 3-D circuits more susceptible to manufacturing defects and lowers the overall yield of the bonded 3-D stack. Testing is another complicated task for 3-D ICs, where pre-bond test is a prerequisite. Pre-bond testability, in turn, presents new challenges to 3-D clock network design primarily due to the incomplete clock distribution networks prior to the bonding of the planes. A design methodology of resonant 3-D clock networks that support wireless pre-bond testing is introduced. To efficiently address this issue, inductive links are exploited to wirelessly transmit the clock signal to the disjoint resonant clock networks. The inductors comprising the LC tanks are used as the receiver circuit for the links, essentially eliminating the need for additional circuits and/or interconnect resources during pre-bond test. Recent FPGAs are quite complex circuits which provide reconfigurablity at the cost of lower performance and higher power consumption as compared to ASIC circuits. Exploiting a large number of programmable switches, routing structures are mainly responsible for performance degradation in FPAGs. Employing 3-D technology can providemore efficient switches which drastically improve the performance and reduce the power consumption of the FPGA. RRAM switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. Along with the configurable switches, buffers are the other important element of the FPGAs routing structure. Different characteristics of RRAM switches change the properties of signal paths in RRAM-based FPGAs. The on resistance of RRAMswitches is considerably lower than CMOS pass gate switches which results in lower RC delay for RRAM-based routing paths. This different nature in critical path and signal delay in turn affect the need for intermediate buffers. Thus the buffer allocation should be reconsidered. In the last part of this research, the effect of intermediate buffers on signal propagation delay is studied and a modified buffer allocation scheme for RRAM-based FPGA routing path is proposed.

EPFL2015