Metallurgical considerations for accelerated testing of soft solder joints
Graph Chatbot
Chattez avec Graph Search
Posez n’importe quelle question sur les cours, conférences, exercices, recherches, actualités, etc. de l’EPFL ou essayez les exemples de questions ci-dessous.
AVERTISSEMENT : Le chatbot Graph n'est pas programmé pour fournir des réponses explicites ou catégoriques à vos questions. Il transforme plutôt vos questions en demandes API qui sont distribuées aux différents services informatiques officiellement administrés par l'EPFL. Son but est uniquement de collecter et de recommander des références pertinentes à des contenus que vous pouvez explorer pour vous aider à répondre à vos questions.
Unique four-dimensional (4D) deformation data are collected during drained triaxial tests on intact specimens of a natural sensitive clay. This requires the development of a miniature triaxial cell for advanced stress path testing, specifically designed fo ...
Kirigami, the ancient technique of paper cutting, has been successfully applied to enhance the stretchability and ductility of nanoscale graphene. However, existing experimentally realized graphene kirigami (GK) are created by introducing parallel cuts, ex ...
This paper presents an experimental method to follow in-situ the chains network alteration of filled vulcanized rubbers induced by deformation. Macroscopic damage is first investigated on a series of EPDM by quantifying void fraction via Digital Image Corr ...
To reveal the operating mechanisms of plastic deformation in an FCC high-entropy alloy, the activation volumes in CrMnFeCoNi have been measured as a function of plastic strain and temperature between 77 K and 423 K using repeated load relaxation experiment ...
A method for manufacturing an object including the steps of forming layers by adding successive layers of material to form the object by selective laser melting (SLM), and inducing plastic deformation and residual stress into solidified material of at leas ...
This paper expands on the impact of the thermally induced deformation of the soil on the serviceability mechanical performance (i.e., deformation-related) of energy pile groups. The work is based on the results of a full-scale in-situ test that was perform ...
In this article, the hot deformation mechanism of a laser-welded near a TA15 Ti-alloy joint was studied by hot tensile tests conducted at temperatures ranging from 800 degrees C to 900 degrees C with strain rates ranging from 1.0 x 10(-1) s(-1) to 1.0 x 10 ...
In this study, the hot deformation behavior of an Al-1% Mg alloy with very coarse initial grain size was investigated in terms of flow stress evolution and grain refinement mechanism. The large grain size was employed to study the traditional continuous dy ...
In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu joints are subjected to elevated homologous temperatures f ...
Integrated circuit packaging technology has become a prime design consideration for the develop-ment of electronic system concepts. One key issue is the bonding layer between chip and substrate. Currently, high-lead solder materials are being used, which a ...
