Early Wire Characterization for Predictable Network-on-Chip Global Interconnects
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As the complexity of applications grows with each new generation, so does the demand for computation power. To satisfy the computation demands at manageable power levels, we see a shift in the design paradigm from single processor systems to Multiprocessor ...
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Designing a power-efficient interconnection architec- ture for MultiProcessor Systems-on-Chips (MPSoCs) satisfying the application performance constraints is a nontrivial task. In order to meet the tight time-to-market constraints and to effec- tively hand ...
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3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequential order, the size of the vertical contacts is similar to traditional contac ...