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Experimental and numerical studies on size and constraining effects in lead-free solder joints

Publications associées (63)

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Coupled hydro-mechanical analysis of compacted bentonite behaviour during hydration

Lyesse Laloui, Alessio Ferrari, Jose Antonio Bosch Llufriu

This study analyses the response of compacted bentonites upon hydration based on a coupled hydro-mechanical elasto-plastic framework. As an alternative to multi-porosity interpretation, the framework was selected based on the experimental evidence of adsor ...

2021

Investigations and numerical modeling of mechanical properties of tempered martensitic steel Eurofer97 at various loading rates, temperatures and after spallation irradiation

Serafin Knitel

The reduced activation tempered martensitic steel Eurofer97 is a reference steel for a structural applica-tions in fusion reactors. The first-wall and blanket materials will be subjected to high thermal and neutron fluxes and will experience very complex, ...

EPFL2018

Ductility, recovery and strain rate dependency of an acrylic structural adhesive

Thomas Keller, Anastasios Vassilopoulos, Myrsini Angelidi

The ductility and time-dependent recovery of a ductile acrylic adhesive were investigated in this work. The quasi-static true tensile and compressive strain behaviors were examined at different strain rates, taking large deformations into account. Yield st ...

Elsevier2017

The flow stress evolution and grain refinement mechanisms during hot deformation of Al-Mg alloy

Roland Logé, Ke Huang

In this study, the hot deformation behavior of an Al-1% Mg alloy with very coarse initial grain size was investigated in terms of flow stress evolution and grain refinement mechanism. The large grain size was employed to study the traditional continuous dy ...

2017

Creep and stress relaxation of a FeMnSi-based shape memory alloy at low temperatures

Cyril Cayron, Christian Leinenbach

The creep and stress relaxation behavior of a Fe-17Mn-5Si-10Cr-4Ni-1(V,C) (wt%) shape memory alloy at low homologous temperatures (-45 degrees C < T < 50 degrees C) was systematically studied in stress and strain controlled tensile tests. At constant stres ...

Elsevier2016

Integrated circuit packaging technology has become a prime design consideration for the develop-ment of electronic system concepts. One key issue is the bonding layer between chip and substrate. Currently, high-lead solder materials are being used, which a ...

EPFL2016

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A novel sensor based on thick-film + LTCC (low-temperature cofired ceramic) technology has been recently developed for sensing high-frequency 3D magnetic fields in tokamak fusion devices. For integration within the walls of the tokamak, the sensor has to b ...

IMAPS / ACerS2015

Optimisation of industrial production of low-force sensors – adhesive bonding of force-centring ball

Peter Ryser, Thomas Maeder, Caroline Jacq, Maxime Blot

This work addresses the issue of attaching the force-centring part (a round ball) to the load cell of a force sensor, a piezoresistive thick-film Wheatstone bridge deposited onto a ceramic cantilever. As the current soldering process requires expensive met ...

IOP2015

Transparent polymer interlayers are usually adopted to laminate glass members dealing with structural roles. Currently, they are also used to realize laminated adhesive connec-tions joining structural glass components (e.g. steel-to-glass connections). Res ...

Taylor & Francis Group2014

The purpose of this review is to discuss the development and the state of the art in dynamic testing techniques and dynamic mechanical behaviour of rock materials. The review begins by briefly introducing the history of rock dynamics and explaining the sig ...

Springer Wien2014