Deformation and Damage in Lead-free Solder Joints : Microstructure-based Modeling and Experimental Characterization

For environmental reasons, lead has been banned from microelectronic solder materials since the adoption of the RoHS legislation in 2006. A large number of investigations have lead to the development of new lead-free solder materials like the SnAgCu alloy which can satisfy most of the technological requirements. However, the long-time reliability of the lead-free candidates is still a crucial issue and in several cases, failure of electronic assemblies has been attributed to that of the solder joints. To overcome the present challenge in the soldering technology, the damage mechanisms occurring along the service life of lead-free solder joints like microstructure evolution, viscoplastic deformation as well as interfacial cracking must be better understood. The main scope of this thesis is to shed light on the complex interdependency of microstructures, deformation property and the interfacial fracture of solder joints in order to explain the change in the failure mode of solder joints from ductile to brittle interfacial fracture as well as the link between microstructural evolution and the change in the mechanical property of the solders. The first part of this research focused on characterization and macroscopic modeling of the fracture at the interface of SnAgCu solder and Cu substrate with a special attention on the viscoplastic nature of the bulk solder. For this purpose, the viscoplastic behavior of the solder joint was initially identified and the material parameters related to a unified constitutive viscoplastic model were determined. The interfacial fracture behavior of the joint was characterized by performing stable fracture tests at different strain rates. The results confirmed that the failure mode of the solder joint is a function of the loading rate. It was shown that an increase in the loading rate causes a decrease in the load-bearing capacity of the joint by enhancing the tendency to develop an interfacial failure. The interfacial crack propagation in the fracture tests were simulated by developing a detailed three-dimensional (3D) finite element (FE) model containing a cohesive interface and considering the viscoplastic behavior of the bulk solder. The influence of strain rate and viscoplasticity on the load-bearing capacity and failure behavior of the joint were pointed out by analyzing the simulation results. It was shown how the normal stress generated at the interface is limited by the significant viscoplastic relaxation developed in the bulk solder at low strain rates, while a large portion of the external work is transferred to the interface at higher rates which gives rise to interfacial fracture. The second part of this thesis focused on developing microstructure-based models in order to simulate the change in the macroscopic mechanical response of the SnAgCu solder caused by the microstructural evolution during thermal ageing. For this purpose, first, the 3D configurations of microstructures in different ageing conditio