Tunable biocomposite films fabricated using cellulose nanocrystals and additives for food packaging

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Non-contact sub-nanometer optical repositioning using femtosecond lasers

Yves Bellouard

Optical components like resonator or waveguides often have stringent requirements in term of positioning accuracy during packaging. While this can be done routinely in a laboratory environment, permanently positioning and aligning optical elements with nan ...

Optical Society of America2015

Reliability Aspects of Microelectromechanical Systems for Space Applications : Mechanical Properties of Structural Materials and Analysis of Packaging Strains

Tobias Bandi

Microelectromechanical systems (MEMS) are an essential ingredient in many technological innovations and a source of game-changing inventions in the automotive industry, space exploration, consumer electronics and medical applications due to its capability ...

EPFL2014

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

Nico de Rooij, Danick Briand, Yves Pétremand

This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...

Institute of Physics2013

An analysis of destination choice for opaque airline products using multidimensional binary logit models

Michel Bierlaire, Alexandre Khelifa

We investigate how customers respond to an opaque airline product offered by a European carrier. In this opaque product design, customers are randomly assigned to travel to one of approximately ten destinations; however, for a fee they may exclude one or m ...

Pergamon-Elsevier Science Ltd2012

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater

An innovative multifunctional LTCC module has been designed for miniature atomic clock packaging. The components of miniature atomic clocks need to be efficiently packaged and connected to each other, and a precise temperature control is required for them. ...

Trans Tech Publications2012

Effects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging

Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater

Trans Tech Publications Ltd2012

Implantable Antennas for Biomedical Applications

Francesco Merli

Since the introduction of implantable pacemakers in the early 1960s, implantable medical devices have become more and more interesting for healthcare services. Nowadays, the devices designed to monitor physiological data from inside the human body have gre ...

EPFL2011

Categorical Foundations for K-theory

Nicolas Mathieu Michel

K-Theory was originally defined by Grothendieck as a contravariant functor from a subcategory of schemes to abelian groups, known today as K0. The same kind of construction was then applied to other fields of mathematics, like spaces and (not necessarily c ...

EPFL2010

Electrical modeling and design of a wafer-level package for MEM resonators

Mihai Adrian Ionescu, Anja Skrivervik, Julien Perruisseau-Carrier, Marco Mazza

This paper presents the electrical design and characterization of a wafer-level, or 0-level, package for micro-electromechanical resonators. We start by identifying the requirements on the electrical parasitics of a packaged resonator, derived from an anal ...

Institute of Electrical and Electronics Engineers2010

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

Frank Seigneur

The quantity of MEMS manufacturers has considerably been increasing these last years. This doesn't mean that the introduction of such products on the market has become easier. A packaging operation is needed to obtain a usable product out of a microsystem. ...

EPFL2009

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Reliability Aspects of Microelectromechanical Systems for Space Applications : Mechanical Properties of Structural Materials and Analysis of Packaging Strains

Tobias Bandi

EPFL2014