Publication
In this manuscript, we studied the effect of additive manufacturing pretreatment on bacterial adhesion and inactivation on copper-based interfaces. Sandblasting, mirror polishing and Surface Mechanical Attrition Treatment (SMAT) at high or low energies have been employed to modify the substrate's (316L stainless steel) roughness. The pretreated substrates were coated with thin copper films using magnetron sputtering. The thin copper films' composition and antibacterial activities were first optimized by being deposited on an Si wafer. We showed that the surface roughness profile influenced bacterial adhesion in the dark. Bacterial inactivation was monitored under indoor light. Stereomicroscopy imaging showed live/dead bacterial cells on the coated substrates. Scanning electron microscopy (SEM) showed homogeneous coating growths of copper with a columnar texture. The chemical composition of the deposited Cu thin films was carried out by Energy Dispersive X-ray Spectroscopy (EDX) and showed a uniform distribution of copper and oxygen, revealing the formation of copper oxides (CuxO). The oxygen content of the sputtered films varied from 7.8 to 25%, justifying the semi-conductor behavior of the thin films under indoor light. The crystallographic structure of the sputtered thin films was investigated using X-ray diffraction (XRD), showing the cubic Cu peaks and characteristic peaks of Cu2O. The Cu peaks at 2 theta values of 43.28 degrees, 50.40 degrees and 74.81 degrees were attributed to the (111), (200) and (220) planes, respectively. The use of genetically modified bacteria (without porins) allowed the rationalization of the predominant effect of the extracellular bacterial inactivation compared to that of intracellular bacterial inactivation through ion release and diffusion.