Publication

Low temperature integration methods using conductive adhesives and dry film photoresist for flexible electronics

Publications associées (26)

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Polymeric semiconductors have gained significant attention in the field of organic electronics due to their unique properties and potential applications. Through their ability to transport charge carriers and to absorb or emit light, they have attracted mu ...

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Recent progress in silk fibroin-based flexible electronics

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With the rapid development of the Internet of Things (IoT) and the emergence of 5G, traditional silicon-based electronics no longer fully meet market demands such as nonplanar application scenarios due to mechanical mismatch. This provides unprecedented op ...

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In-situ laser sintering for the fabrication of fully 3D printed electronics composed of elastomeric materials

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In-situ laser sintering can be used to locally sinter conductive inks in an uninterrupted process, enabling the embedding of printed electronics within 3D printed structures. In this work we apply a laser sintering method to create highly conductive silver ...

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Sequential manufacturing via intra-additive hybrid materials approach for fully roll-to-roll processed flexible organic thin film transistors

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Conventional conductive films that are used as electrodes in organic thin film transistors (OTFTs) are susceptible to mechanical deformation, limiting the applicability of such films in flexible wearable electronic devices. To address this limitation, a hy ...

ELSEVIER SCI LTD2021

Synthesis of NIR-Absorbing Squaraine Dyes and their Use in Organic Upconversion Devices

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Squaraines are organic dyes showing the advantages of a simple synthesis, high absorption coefficients and tunable bandgaps from the visible to the near-infrared (NIR) region. Their molecular structure is based on a polymethine chain and a donor-acceptor-d ...

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Dimensional scaling of high-speed printed organic transistors enabling high-frequency operation

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Printed electronics has promised to deliver low-cost, large-area and flexible electronics for mass-market applications for some time; however, so far one limiting factor has been device performance. Over the last decade, great progress has been made in ter ...

IOP PUBLISHING LTD2020

Rational Design of Hole Transport Materials: Tools and Structure-Packing-Property Relationships

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The growing demand for low-cost, large-scale and flexible electronics has led to a boost in research on organic semiconductors (OSC). Understanding structure-packing-property relationships (SPPR) and the role of molecular building blocks in charge transpor ...

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Monica Morales Masis, Angela Nicole Fioretti

Transparent conductive materials (TCMs) with high p-type conductivity and broadband transparency have remained elusive for years. Despite decades of research, no p-type material has yet been found to match the performance of n-type TCMs. If developed, the ...

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