Mold metallization process for the batch fabrication of high-resolution MRI solenoidal micro-coils enabling low loss integration of electronic devices

We present a general metallization process for the fabrication of solenoidal micro-coils for high resolution MRI of volume-limited samples. The process allows for the MEMS-compatible batch fabrication of identical coils. Hollow conductors are integrated within a planar wafer geometry, enabling the low loss connection to external tuning/matching devices. A high filling-factor is achieved by the small coil dimensions and thin sample container walls, and the solenoidal geometry ensures a homogeneous magnetic field. Glass wafers were chosen as base substrate for their superior dielectric properties as compared to silicon, additionally allowing for simultaneous optical observation of the inserted sample.