Concept

Whisker (metallurgy)

Related publications (10)

Progress in modelling solidification microstructures in metals and alloys. Part II: dendrites from 2001 to 2018

This is the first account of the history of modelling dendritic and cellular solidification. While Part I reviewed the progress up to the year 2000 [Kurz W, Fisher DJ, Trivedi R. Progress in modelling solidification microstructures in metals and alloys: de ...

TAYLOR & FRANCIS LTD2020

Progress in modelling solidification microstructures in metals and alloys: dendrites and cells from 1700 to 2000

Wilfried Kurz

This is the first account of the history of our understanding of, and ability to model, solidification microstructures. Its objective is to retrace the scientific steps made, from the earliest observations of the eighteenth century to our present-day under ...

TAYLOR & FRANCIS LTD2019

From the early steps of whisker formation to its evolutionary disappearance: the (curious) case of Prdm1 and its regulation

Pierluigi Giuseppe Manti

Whiskers (also known as vibrissae) are sensory organs that are thought to have first appeared in Therapsida, a group of synapsids that includes mammals and evolutionary ancestors like the Thrinaxodon(1). They are highly conserved among mammals to the notab ...

EPFL2016

A Subcutaneous Biochip for Remote Monitoring of Human Metabolism: Packaging and Biocompatibility Assessment

Giovanni De Micheli, Sandro Carrara, Jacopo Olivo, Andrea Cavallini, Seyedeh Sara Ghoreishizadeh

This paper represents the extended version of the conference paper “Developing highly-integrated subcutaneous biochips for remote monitoring of human metabolism” pre- sented at the IEEE Sensors Conference 2012, and presents data on assembly, packaging and ...

Institute of Electrical and Electronics Engineers2015

Wetting Behavior of Ternary Au-Ge-X (X = Sb, Sn) Alloys on Cu and Ni

Christian Leinenbach, Shan Jin

Au-Ge-based alloys are potential substitutes for Pb-rich solders currently used for high-temperature applications. In the present work, the wetting behavior of two Au-Ge-X (X = Sb, Sn) ternary alloys, i.e., Au-15Ge-17Sb and Au-13.7 Ge-15.3Sn (at.%), in con ...

Springer2013

Reliability Analysis of Lead-free Solders

John Botsis, Joël Cugnoni

In this study, a deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application. Creep properties of this solder composition have been investigated, and results have ...

Int Assoc Engineers-Iaeng, Unit1, 1-F, 37-39 Hung To Road, Kwun Tong, Hong Kong, 00000, Peoples R China2008

Reliability analysis of lead-free solders for an aerospace application

A deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application, SwissCube’s motherboard (MB). Since 2006, using Pb in consumer electronics has been banned. Aerospac ...

2008

Reliability analysis of lead-free solders for an aerospace application

2008

Correlating whisker behavior with membrane potential in barrel cortex of awake mice

Carl Petersen, Sylvain Crochet

To investigate synaptic events underlying sensory perception, we made whole-cell membrane potential recordings of barrel cortex neurons in awake mice while recording whisker-related behavior. During quiet periods, we recorded slow, large-amplitude membrane ...

2006

The fabrication and properties of Nb3Sn superconductors by the internal tin process

This paper describes recent progress in the development of Nb3Sn wires in Switzerland using the internal tin method The work war carried out in close collaboration between the Fusion Technology Division of CRPP and Swissmetal, with the emphasis on conducto ...

1996

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