Heat flux | EPFL Graph Search

In physics and engineering, heat flux or thermal flux, sometimes also referred to as heat flux density, heat-flow density or heat flow rate intensity, is a flow of energy per unit area per unit time. Its SI units are watts per square metre (W/m2). It has both a direction and a magnitude, and so it is a vector quantity. To define the heat flux at a certain point in space, one takes the limiting case where the size of the surface becomes infinitesimally small. Heat flux is often denoted \vec{\phi}_\mathrm{q}, the subscript q specifying heat flux, as opposed to mass or momentum flux. Fourier's law is an important application of these concepts. Fourier's law Thermal conduction#Fourier's law For most solids in usual conditions, heat is transported mainly by conduction and the heat flux is adequately described by Fourier's law. Fourier's law in one dimension \phi_\text{q} = -k \frac{\mathrm{d}T(x)}{\mathrm{d}x} where

Cooling High Heat Flux Micro-Electronic Systems using Refrigerants in High Aspect Ratio Multi-Microchannel Evaporators

Etienne Costa-Patry

Improving the energy efficiency of cooling systems can contribute to reduce the emission of greenhouse gases. Currently, most microelectronic applications are air-cooled. Switching to two-phase cooling systems would decrease power consumption and allow for the reuse of the extracted heat. For this type of application, multi-microchannel evaporators are thought to be well adapted. However, such devices have not been tested for a wide range of operating conditions, such that their thermal response to the high non-uniform power map typically generated by microelectronics has not been studied. This research project aims at clarifying these gray areas by investigating the behavior of the two-phase flow of different refrigerants in silicon and copper multi-microchannel evaporators under uniform, non-uniform and transient heat fluxes operating conditions. The test elements use as a heat source a pseudo-chip able to mimic the behavior of a CPU. It is formed by 35 independent sub-heaters, each having its own temperature sensor, such that 35 temperature and 35 heat flux measurements can be made simultaneously. Careful measurements of each pressure drop component (inlet, microchannels and outlet) found in the micro-evaporators showed the importance of the inlet and outlet restriction pressure losses. The overall pressure drop levels found in the copper test section were low enough to possibly be driven by a thermosyphon system. The heat transfer coefficients measured for uniform heat flux conditions were very high and typically followed a V-shape curve. The first branch was associated to the slug flow regime and the second to the annular flow regime. By tracking the minimum level of heat transfer, a transition criteria between the regimes was established, which included the effect of heat flux on the transition. Then for each branch, a different prediction method was used to form the first flow pattern-based prediction method for two-phase heat transfer in microchannels. A non-uniform heat flux creates important temperature gradients in the evaporator, such that the data reduction procedure needs to be adapted to include heat spreading within the evaporator. To do so, a robust multi-dimensional thermal conduction scheme was developed. Once these effects were taken into consideration, the local heat transfer coefficients provided by two-phase flow were found to be the same for uniform and non-uniform heat fluxes, allowing the flow pattern-based method to be extended to non-uniform heat flux conditions. Lastly, with proper control of the mass flow, transient heat flux situations were well handled by the micro-evaporators.

EPFL2011

Boiling on a Tube Bundle

Eugene van Rooyen

The complexity of two-phase flow boiling on a tube bundle presents many challenges to the understanding of the physical phenomena taking place. It is important to quantify these numerous heat flow mechanisms in order to better describe the performance of tube bundles as a function of the operational conditions. In the present study, the bundle boiling facility at the Laboratory of Heat and Mass Transfer (LTCM) was modified to obtain high-speed videos to characterise the two-phase regimes and some bubble dynamics of the boiling process. It was then used to measure heat transfer on single tubes and in bundle boiling conditions. Pressure drop measurements were also made during adiabatic and diabatic bundle conditions. New enhanced boiling tubes from Wolverine Tube Inc. (Turbo-B5) and the Wieland-Werke AG (Gewa-B5) were investigated using R134a and R236fa as test fluids. The tests were carried out at saturation temperatures Tsat of 5°C and 15°C, mass flow rates from 4 to 35 kg/m2s and heat fluxes from 15 to 70 kW/m2, typical of actual operating conditions. The flow pattern investigation was conducted using visual observations from a borescope inserted in the middle of the bundle. Measurements of the light attenuation of a laser beam through the intertube two-phase flow and local pressure fluctuations with piezo-electric pressure transducers were also taken to further help in characterising the complex flow. Pressure drop measurements and data reduction procedures were revised and used to develop new, improved frictional pressure drop prediction methods for adiabatic and diabatic two-phase conditions. The physical phenomena governing the enhanced tube evaporation process and their effects on the performance of tube bundles were investigated and insight gained. A new method based on a theoretical analysis of thin film evaporation was used to propose a new correlating parameter. A large new database of local heat transfer coefficients were obtained and then utilised to generate improved prediction methods for pool boiling and bundle boiling, including a method for predicting the onset of dryout.

EPFL2011

Flow Boiling Pressure Drop and Heat Transfer of Refrigerants in Multi-microchannel Evaporators under Steady and Transient States

Houxue Huang

Multi-microchannel evaporators used for the cooling of high heat flux electronics have been of interest to both industry and academia for more than a decade. Such interest has sparked a large number of research studies on the flow boiling pressure drop and heat transfer in multi-microchannel evaporators. However, there are still several aspects that need to be addressed in order to better understand the complicated flow boiling process taking place in such micro-evaporators. Firstly, the mechanism governing flow boiling heat transfer in microchannels is arguable; secondly, the availability of fine-resolution local heat transfer data is very limited; thirdly, over-simplified heat conduction models are used in the literature to reduce such local heat transfer data; finally, rare attention has been taken on the thermal behavior of such micro-evaporators under transient status.\ Inspired by the forgoing aspects, an extensive experimental program has been conducted to study the flow boiling pressure drop and heat transfer of refrigerants in multi-microchannel evaporators under steady and transient status. For the steady-state tests, three fluids ( R245fa, R236fa and R1233zd(E)) were tested in two multi-microchannel evaporators. The silicon microchannel evaporators were 10 mm long and 10 mm wide, having 67 parallel channels, each 100

\times

100

\mu

^2

, separated by a fin with a thickness of 50

\mu m

. Two types of micro-orifices (25 and 50

\mu

^2

in width) were placed at the entrance of each channel to stabilize the two-phase flow and to obtain good flow distribution. The test section backside temperatures were measured by a self-calibrated infrared (IR) camera. The operating conditions for stable flow boiling tests were: mass fluxes from 1250 to 2750 kg~m

^{-2}

^{-1}

, heat fluxes from 20 to 64 W cm

^{-2}

, inlet subcoolings of 5.5, 10 and 15 K, and nominal outlet saturation temperatures of 31.5, 35 and 40

^{\circ}\mathrm{C}

. The resulting maximum exit vapor quality at the outlet manifold was 0.51. \ The steady-state experimental data were reduced by solving a 3D inverse heat conduction problem to obtain the local heat transfer coefficients on a pixel-by-pixel basis. The required fluid temperature in the subcooled region was calculated from the local energy balance, while that in the saturated flow boiling region came from the general pressure drop model proposed in this manuscript based on the present data base. According to the present data base of fine-resolution local heat transfer coefficients, a new flow pattern based prediction model was developed here starting from the subcooled region all the way through the annular flow regime. This new flow pattern based model predicted the total local heat transfer database (1,941,538 local points) well with a MAE of 14.2% and with 90.1% of the data predicted within

\pm

30%. It successfully tracks the experimental trends without any jumps in predictions when changing flow patterns.\ For the transient tests, an extensive experimental study was conducted to investigate the base temperature response of multi-microchannel evaporators under transient heat loads, including cold startups and periodic step variations in heat flux using two different test sections and two coolants (R236fa and R245fa) for a wide variety of test conditions. In addition, a transient flow boiling test under a heat flux disturbance was performed, and a new method of solving the transient 3D inverse heat conduction problem was proposed to obtain the local transient flow boiling heat transfer coefficients.

EPFL2016